公开(公告)号：US20150076675A1

公开(公告)日：2015-03-19

申请号：US14027975

申请日：2013-09-16

Applicant: STMicroelectronics, Inc.

Inventor： Rogelio Real ,  William Cabreros

IPC: H01L23/00

CPC classification number: H01L21/561 ,  H01L21/4832 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of the present disclosure are directed to leadframe packages with wettable sides and methods of manufacturing same. In one embodiment, the leads of the leadframe packages have recesses with a curved profile formed therein. The recesses are plated with a solder wettable layer of conductive material that enables solder to flow along the surface during surface mounting of the package to a board, such as a PCB.

Abstract translation: 本公开的实施例涉及具有可湿侧的引线框封装及其制造方法。 在一个实施例中，引线框封装的引线具有形成在其中的弯曲轮廓的凹部。 这些凹槽镀有导电材料的焊料可润湿层，其使得焊料能够在将封装表面安装到诸如PCB的板的过程中沿表面流动。

公开(公告)号：US09012268B2

公开(公告)日：2015-04-21

申请号：US13931325

申请日：2013-06-28

Applicant: STMicroelectronics, Inc.

Inventor： Jonathan Jaurigue ,  Rogelio Real ,  Francis Ann Llana ,  Ricky Calustre ,  Rodolfo Gacusan

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/495 ,  H01L23/00 ,  H01L21/82

CPC classification number: H01L24/96 ,  H01L21/4821 ,  H01L21/561 ,  H01L21/568 ,  H01L21/82 ,  H01L23/3121 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83005 ,  H01L2224/85005 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Embodiments of the present disclosure are directed to leadframe strips and methods of forming packages that include first separating adjacent leads of a leadframe strip and subsequently singulating components into individual packages. In one embodiment, the adjacent leads are separated by etching through the leads, thereby providing electrical isolation of the adjacent packages. In that regard, if desired, the individual adjacent packages may be electrically tested in leadframe strip form. Subsequently, the individual packages are formed by sawing through the encapsulation material.

Abstract translation: 本公开的实施例涉及引线框条和形成封装的方法，其包括首先分离引线框带的相邻引线，并随后将元件分成单个封装。 在一个实施例中，通过蚀刻通过引线分离相邻的引线，由此提供相邻封装的电隔离。 在这方面，如果需要，各个相邻的封装可以以引线框带形式进行电测试。 随后，通过锯切通过包封材料形成各个包装。

公开(公告)号：US20150001698A1

公开(公告)日：2015-01-01

申请号：US13931325

申请日：2013-06-28

Applicant: STMicroelectronics, Inc.

Inventor： Jonathan Jaurigue ,  Rogelio Real ,  Francis Ann Llana ,  Ricky Calustre ,  Rodolfo Gacusan

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/82

CPC classification number: H01L24/96 ,  H01L21/4821 ,  H01L21/561 ,  H01L21/568 ,  H01L21/82 ,  H01L23/3121 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83005 ,  H01L2224/85005 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Embodiments of the present disclosure are directed to leadframe strips and methods of forming packages that include first separating adjacent leads of a leadframe strip and subsequently singulating components into individual packages. In one embodiment, the adjacent leads are separated by etching through the leads, thereby providing electrical isolation of the adjacent packages. In that regard, if desired, the individual adjacent packages may be electrically tested in leadframe strip form. Subsequently, the individual packages are formed by sawing through the encapsulation material.

Abstract translation: 本公开的实施例涉及引线框条和形成封装的方法，其包括首先分离引线框带的相邻引线，并随后将元件分成单个封装。 在一个实施例中，通过蚀刻通过引线分离相邻的引线，由此提供相邻封装的电隔离。 在这方面，如果需要，各个相邻的封装可以以引线框带形式进行电测试。 随后，通过锯切通过包封材料形成各个包装。