公开(公告)号：US09324643B1

公开(公告)日：2016-04-26

申请号：US14566826

申请日：2014-12-11

Applicant: STMICROELECTRONICS, INC.

Inventor： Ela Mia Cadag ,  Ricky Calustre

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/49541 ,  H01L21/56 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/544 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85005 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/35121 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/0665

Abstract: An integrated circuit (IC) device includes an IC die and encapsulation material surrounding the IC die. A first set of leads is coupled to the IC die and has first contact pads exposed on a bottom surface of the encapsulation material adjacent its periphery. A second set of leads is coupled to the IC die and has second contact pads exposed on the bottom surface of the encapsulation material adjacent its periphery. The second set of leads has internal ends extending laterally inwardly from respective ones of the second contact pads to define a die pad area supporting the IC die.

Abstract translation: 集成电路（IC）装置包括IC芯片和围绕IC芯片的封装材料。 第一组引线耦合到IC管芯，并且具有暴露在邻近其周边的封装材料的底表面上的第一接触焊盘。 第二组引线被耦合到IC管芯并且具有暴露在密封材料的底表面上的邻近其周边的第二接触焊盘。 第二组引线具有从相应的第二接触焊盘横向向内延伸的内部端部，以限定支撑IC管芯的管芯焊盘区域。

公开(公告)号：US09012268B2

公开(公告)日：2015-04-21

申请号：US13931325

申请日：2013-06-28

Applicant: STMicroelectronics, Inc.

Inventor： Jonathan Jaurigue ,  Rogelio Real ,  Francis Ann Llana ,  Ricky Calustre ,  Rodolfo Gacusan

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/495 ,  H01L23/00 ,  H01L21/82

CPC classification number: H01L24/96 ,  H01L21/4821 ,  H01L21/561 ,  H01L21/568 ,  H01L21/82 ,  H01L23/3121 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83005 ,  H01L2224/85005 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Embodiments of the present disclosure are directed to leadframe strips and methods of forming packages that include first separating adjacent leads of a leadframe strip and subsequently singulating components into individual packages. In one embodiment, the adjacent leads are separated by etching through the leads, thereby providing electrical isolation of the adjacent packages. In that regard, if desired, the individual adjacent packages may be electrically tested in leadframe strip form. Subsequently, the individual packages are formed by sawing through the encapsulation material.

Abstract translation: 本公开的实施例涉及引线框条和形成封装的方法，其包括首先分离引线框带的相邻引线，并随后将元件分成单个封装。 在一个实施例中，通过蚀刻通过引线分离相邻的引线，由此提供相邻封装的电隔离。 在这方面，如果需要，各个相邻的封装可以以引线框带形式进行电测试。 随后，通过锯切通过包封材料形成各个包装。

公开(公告)号：US20150001698A1

公开(公告)日：2015-01-01

申请号：US13931325

申请日：2013-06-28

Applicant: STMicroelectronics, Inc.

Inventor： Jonathan Jaurigue ,  Rogelio Real ,  Francis Ann Llana ,  Ricky Calustre ,  Rodolfo Gacusan

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/82

CPC classification number: H01L24/96 ,  H01L21/4821 ,  H01L21/561 ,  H01L21/568 ,  H01L21/82 ,  H01L23/3121 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83005 ,  H01L2224/85005 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Embodiments of the present disclosure are directed to leadframe strips and methods of forming packages that include first separating adjacent leads of a leadframe strip and subsequently singulating components into individual packages. In one embodiment, the adjacent leads are separated by etching through the leads, thereby providing electrical isolation of the adjacent packages. In that regard, if desired, the individual adjacent packages may be electrically tested in leadframe strip form. Subsequently, the individual packages are formed by sawing through the encapsulation material.

Abstract translation: 本公开的实施例涉及引线框条和形成封装的方法，其包括首先分离引线框带的相邻引线，并随后将元件分成单个封装。 在一个实施例中，通过蚀刻通过引线分离相邻的引线，由此提供相邻封装的电隔离。 在这方面，如果需要，各个相邻的封装可以以引线框带形式进行电测试。 随后，通过锯切通过包封材料形成各个包装。