公开(公告)号：US20040195685A1

公开(公告)日：2004-10-07

申请号：US10405529

申请日：2003-04-02

Applicant: STMicroelectronics, Inc.

Inventor： Anthony M. Chiu ,  Tom Q. Lao

IPC: H01L023/48

CPC classification number: H01L23/562 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/341 ,  H05K2203/1178 ,  H05K2203/304 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A system and method is disclosed for venting pressure from an integrated circuit package that is sealed with a lid. During a surface mount process for mounting a ball grid array integrated circuit package to a circuit board the application of heat (1) weakens the solder that seals a soldered lid, and (2) increases vapor pressure within the integrated circuit package. This may cause the soldered lid to move out of its soldered position. The present invention solves this problem by providing an integrated circuit with a solder mask that has a plurality of solder mask vents that form a plurality of vapor pressure vents through the solder. The vapor pressure vents prevent the occurrence of any increase in vapor pressure that would shift the soldered lid out of its soldered position. An alternate embodiment vents pressure through an epoxy layer that is used to attach a lid by epoxy.

Abstract translation: 公开了一种用于从由盖子密封的集成电路封装件排出压力的系统和方法。 在用于将球栅阵列集成电路封装安装到电路板的表面安装过程中，加热（1）的作用削弱了密封焊接盖的焊料，和（2）增加集成电路封装内的蒸汽压力。 这可能导致焊接的盖子从其焊接位置移出。 本发明通过提供具有焊料掩模的集成电路来解决这个问题，该焊接掩模具有多个通过焊料形成多个蒸汽压力通气口的焊接掩模排出口。 蒸汽压力通风口防止蒸汽压力的任何增加的发生，这将使焊接的盖子从其焊接位置移位。 替代实施例通过用于通过环氧树脂附接盖子的环氧树脂层排出压力。