公开(公告)号：US20030235013A1

公开(公告)日：2003-12-25

申请号：US10429266

申请日：2003-05-02

Applicant: STMicroelectronics S.r.I.

Inventor： Marco Del Sarto ,  Mauro Marchi ,  Lorenzo Baldo ,  Simone Sassolini

IPC: G11B005/56

CPC classification number: G11B5/4826

Abstract: A read/write assembly for magnetic hard disks includes at least: one supporting element; one read/write (R/W) transducer; one micro-actuator, set between the R/W transducer and the supporting element; one electrical-connection structure for connection to a remote device carried by the supporting element and connected to the R/W transducer and to the micro-actuator. In addition, a protective structure, set so as to cover the micro-actuator is made of a single piece with the electrical-connection structure.

Abstract translation: 用于磁性硬盘的读/写组件至少包括：一个支撑元件; 一个读/写（R / W）传感器; 一个微致动器，设置在R / W换能器和支撑元件之间; 一个电连接结构，用于连接到由支撑元件承载并连接到R / W传感器和微致动器的远程设备。 此外，设置成覆盖微致动器的保护结构由具有电连接结构的单件制成。

公开(公告)号：US20030109183A1

公开(公告)日：2003-06-12

申请号：US10243972

申请日：2002-09-12

Applicant: STMicroelectronics S.r.I. ,  Hewlett-Packard Company

Inventor： Ubaldo Mastromatteo ,  Mauro Bombonati ,  Daniela Morin ,  Marta Mottura ,  Mauro Marchi

IPC: H01R009/22

CPC classification number: B81C1/00269 ,  H01L21/185 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05181 ,  H01L2224/05624 ,  H01L2224/10126 ,  H01L2224/10135 ,  H01L2224/13021 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13124 ,  H01L2224/13164 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/812 ,  H01L2224/81201 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/013

Abstract: A process for bonding two distinct substrates that integrate microsystems, including the steps of forming micro-integrated devices in at least one of two substrates using micro-electronic processing techniques and bonding the substrates. Bonding is performed by forming on a first substrate bonding regions of deformable material and pressing the substrates one against another so as to deform the bonding regions and to cause them to react chemically with the second substrate. The bonding regions are preferably formed by a thick layer of a material chosen from among aluminum, copper and nickel, covered by a thin layer of a material chosen from between palladium and platinum. Spacing regions ensure exact spacing between the two wafers.