公开(公告)号：US20150027876A1

公开(公告)日：2015-01-29

申请号：US14218583

申请日：2014-03-18

Applicant: Samsung Display Co., Ltd.

Inventor： Seung-Ho CHOI ,  Jong-Jin Park

IPC: C23C14/35 ,  H01J37/34

CPC classification number: C23C14/352 ,  H01J37/3417 ,  H01J37/3429 ,  H01J37/345 ,  H01J37/3452

Abstract: A sputtering system includes a chamber, a plurality of targets, and a substrate holder. The targets are disposed in the chamber. Each target includes a magnet unit disposed therein. The substrate holder is configured to support a substrate in the chamber. The magnet units are configured to generate a magnetic field between the targets. Each of the magnet units includes magnets disposed in two rows.

Abstract translation: 溅射系统包括室，多个靶和衬底保持器。 靶位于腔室内。 每个目标包括设置在其中的磁体单元。 衬底保持器构造成支撑腔室中的衬底。 磁体单元配置成在目标之间产生磁场。 每个磁体单元包括设置成两排的磁体。

公开(公告)号：US20150041310A1

公开(公告)日：2015-02-12

申请号：US14226564

申请日：2014-03-26

Applicant: Samsung Display Co., Ltd.

Inventor： Seung-Ho CHOI ,  Dae-Sang Yoon ,  Young-Bun Jeon

IPC: H01J37/34 ,  C23C14/34

CPC classification number: H01J37/3417 ,  C23C14/3464 ,  C23C14/3492 ,  H01J37/342 ,  H01J37/3464

Abstract: A sputtering apparatus includes: a first cylindrical target unit, a second cylindrical target unit facing the first cylindrical target unit; a third cylindrical target unit facing the first cylindrical target unit and the second cylindrical target unit; a fourth cylindrical target unit facing the first cylindrical target unit, the second cylindrical target unit, and the third cylindrical target unit; and a power unit configured to provide power such that two of the first cylindrical target unit, the second cylindrical target unit, the third cylindrical target unit, and the fourth cylindrical target unit function as different electrodes.

Abstract translation: 溅射装置包括：第一圆柱形目标单元，面向第一圆柱形目标单元的第二圆柱形目标单元; 面向所述第一圆筒形目标单元和所述第二圆柱形目标单元的第三圆柱形目标单元; 面向第一圆筒形目标单元的第四圆柱形目标单元，第二圆柱形目标单元和第三圆柱形目标单元; 以及功率单元，被配置为提供功率，使得第一圆柱形靶单元，第二圆柱形目标单元，第三圆柱形目标单元和第四圆柱形目标单元中的两个用作不同的电极。