公开(公告)号：US20230208035A1

公开(公告)日：2023-06-29

申请号：US17981668

申请日：2022-11-07

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hwan JI ,  Jungil KIM ,  Hyunjun CHOI ,  Chin Mo KIM ,  Won Cheol LEE

IPC: H01Q9/04

CPC classification number: H01Q9/0414 ,  H01Q9/045 ,  H01Q21/08

Abstract: An antenna apparatus includes a dielectric layer; and a via that extends through the dielectric layer, the via includes a conductive first portion and a non-conductive second portion surrounded by the conductive first portion. An antenna of the antenna apparatus is fed through the via.

公开(公告)号：US20220085510A1

公开(公告)日：2022-03-17

申请号：US17149968

申请日：2021-01-15

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Juhyoung PARK ,  Daeki LIM ,  Youngsik HUR ,  Sungyong AN ,  Jae Yeong KIM ,  Chin Mo KIM

IPC: H01Q9/04 ,  H04B3/52 ,  H01Q13/28 ,  H01P3/16 ,  H01Q1/24

Abstract: An antenna device includes first and second dielectric layers. The first dielectric layer includes first and second sides facing each other in a third direction. The second dielectric layer includes third and fourth sides facing each other in the third direction. A first antenna patch is disposed on the first side of the first dielectric layer. A second antenna patch is disposed on the third side of the second dielectric layer. Signals with a first frequency bandwidth are transmitted or received electrical signals applied to the first antenna patch. Signals with a different second frequency bandwidth are transmitted or received by an electrical signal applied to the second antenna patch. A height of the second dielectric layer measured to the third side from the fourth side in a direction parallel to a third direction is greater than a height of the first dielectric layer measured to the first side from the second side.

公开(公告)号：US20180130601A1

公开(公告)日：2018-05-10

申请号：US15684645

申请日：2017-08-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo KIM ,  Jong Ho LEE ,  Min Gi SIN ,  Hak Kwan KIM ,  Chin Mo KIM ,  Chi Hwa LEE ,  Hong Seok KIM ,  Woo Sup KIM ,  Chang Hwa PARK

IPC: H01G4/12 ,  H01G4/33 ,  H01G4/10 ,  C04B35/468 ,  C04B35/628

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.

公开(公告)号：US20220149505A1

公开(公告)日：2022-05-12

申请号：US17318417

申请日：2021-05-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chin Mo KIM ,  Sungyong AN

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q7/00 ,  H01Q9/04

Abstract: A chip antenna includes: a dielectric material block including a plurality of sides including a first side, a second side, and a third side that are different from each other; a first antenna portion including a first conductor pattern disposed on the first side; a second antenna portion including a second conductor pattern disposed on the second side; and a third antenna portion including a third conductor pattern disposed on the third side. The first conductor pattern, the second conductor pattern, and the third conductor pattern are respectively isolated on the first side, the second side, and the third side, and are independently positioned.

公开(公告)号：US20180182557A1

公开(公告)日：2018-06-28

申请号：US15654249

申请日：2017-07-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hwa PARK ,  Jin Woo KIM ,  Min Gi SIN ,  Byung Hyun PARK ,  Chin Mo KIM

IPC: H01G4/30 ,  H01G4/10 ,  H01L21/02

Abstract: A dielectric powder includes a core-shell structure including a core region formed in an inner portion thereof and a shell region covering the core region. The core region includes barium titanate (BaTiO3) doped with a metal oxide, and the shell region is formed of a ferroelectric material.

公开(公告)号：US20160307687A1

公开(公告)日：2016-10-20

申请号：US15099921

申请日：2016-04-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chin Mo KIM ,  Jung Wook SEO ,  Eun Hye NA ,  Hak Kwan KIM ,  Hyung Jin JEON ,  Sung Yong AN

IPC: H01F27/255 ,  H01F27/28

CPC classification number: H01F27/255 ,  H01F1/348 ,  H01F17/0013 ,  H01F2017/0093

Abstract: A common mode filter includes a magnetic substrate in which ferrite particles having anisotropy and a planar structure are disposed to have a planar orientation.

Abstract translation: 共模滤波器包括其中具有各向异性的铁氧体颗粒和平面结构设置成具有平面取向的磁性基板。

公开(公告)号：US20230112892A1

公开(公告)日：2023-04-13

申请号：US17861683

申请日：2022-07-11

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Youngjo CHOI ,  Chin Mo KIM ,  Jae Yeong KIM ,  Eun Ju OH

IPC: H01Q9/04 ,  H01Q1/42 ,  H01Q21/06 ,  H01Q21/00 ,  H01Q1/22

Abstract: A chip patch antenna includes an upper dielectric layer including a first dielectric material and a second dielectric material having different dielectric constants from each other and bonded to each other in a planar direction, a first patch antenna electrode and a second patch antenna electrode respectively disposed on one side of each of the first dielectric material and the second dielectric material, a lower dielectric layer spaced from the first dielectric material and the second dielectric material in a thickness direction, and a third patch antenna electrode and a fourth patch antenna electrode disposed on one side of the lower dielectric layer.

公开(公告)号：US20220158327A1

公开(公告)日：2022-05-19

申请号：US17202640

申请日：2021-03-16

Applicant: Samsung Electro-Mechanics Co., Ltd

Inventor： Sungyong AN ,  Chin Mo KIM ,  Jungil KIM ,  Juhyoung PARK ,  Daeki LIM

IPC: H01Q1/22 ,  H01Q1/38 ,  H01Q5/335

Abstract: An antenna device is provided. The antenna device includes an antenna body portion configured to transmit and/or receive a radio frequency (RF) signal, and including a dielectric material having a first dielectric constant; a metal layer configured to contact the antenna body portion; a first insulation layer configured to cover at least a part of the metal layer; and an electrical connection structure configured to be electrically connected to the metal layer, wherein the first dielectric constant of the antenna body portion is larger than a dielectric constant of the first insulation layer, and is smaller than a dielectric constant of the metal layer.

公开(公告)号：US20210384633A1

公开(公告)日：2021-12-09

申请号：US17405286

申请日：2021-09-01

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Chin Mo KIM ,  Ji Hyung JUNG ,  Sung Nam CHO ,  Sung Yong AN

IPC: H01Q9/04 ,  H01Q1/48 ,  H01Q1/38

Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.

公开(公告)号：US20210111478A1

公开(公告)日：2021-04-15

申请号：US16788585

申请日：2020-02-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chin Mo KIM ,  Jae Yeong KIM ,  Sung Yong AN ,  Sung Nam CHO ,  Ji Hyung JUNG

IPC: H01Q1/22 ,  H01Q21/06 ,  H01Q1/42 ,  H01Q9/04

Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).