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公开(公告)号:US12211711B2
公开(公告)日:2025-01-28
申请号:US17666796
申请日:2022-02-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Bumjin Jang , Seunghwa Kang , Sungyong Park , Ansook Sul , Kiju Sohn , Wonguk Seo
IPC: H01L21/67 , H01L21/324
Abstract: A baking apparatus, may include a processing chamber including a lower chamber and an upper chamber connected by a ring shutter; a baking plate in the processing chamber adjacent to a region in which the lower chamber and the ring shutter overlap; an active flow controller including a first module and a second module in the lower chamber adjacent to the baking plate; a first auxiliary flow controller on a lower part of the ring shutter, adjacent to the lower chamber; and a second auxiliary flow controller in the upper chamber adjacent to the ring shutter. The active controller may be configured to move based on movement of the first module in a first direction perpendicular to an upper surface of the baking plate. The active flow controller may be configured to control airflow around the second module by movement of the second module.
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公开(公告)号:US20240412984A1
公开(公告)日:2024-12-12
申请号:US18810623
申请日:2024-08-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ansook Sul , Sungyong Park , Sejin Park , Donok Choi
IPC: H01L21/67 , B08B3/12 , B08B7/00 , H01L21/02 , H01L21/687
Abstract: A substrate drying device includes: an upper chamber body including an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body including an outlet configured to discharge the supercritical fluid out of the chamber space; and a plurality of vibration devices including a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space.
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公开(公告)号:US12119240B2
公开(公告)日:2024-10-15
申请号:US18081948
申请日:2022-12-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ansook Sul , Sungyong Park , Sejin Park , Donok Choi
CPC classification number: H01L21/67034 , B08B3/12 , B08B7/0021 , H01L21/02101 , H01L21/68785
Abstract: A substrate drying device includes: an upper chamber body including an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body including an outlet configured to discharge the supercritical fluid out of the chamber space; and a plurality of vibration devices including a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space.
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公开(公告)号:US20230187231A1
公开(公告)日:2023-06-15
申请号:US18081948
申请日:2022-12-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ansook Sul , Sungyong Park , Sejin Park , Donok Choi
IPC: H01L21/67 , B08B7/00 , B08B3/12 , H01L21/02 , H01L21/687
CPC classification number: H01L21/67034 , B08B7/0021 , B08B3/12 , H01L21/02101 , H01L21/68785
Abstract: A substrate drying device includes: an upper chamber body including an inlet configured to introduce supercritical fluid into a chamber space; a lower chamber body including an outlet configured to discharge the supercritical fluid out of the chamber space; and a plurality of vibration devices including a plurality of vibration modules configured to generate ultrasonic waves having different frequencies from each other, and substrate holders arranged on the plurality of vibration modules and configured to hold a wafer, wherein the plurality of vibration devices are arranged in the chamber space.
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公开(公告)号:US11590460B2
公开(公告)日:2023-02-28
申请号:US17239644
申请日:2021-04-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Wonguk Seo , Sungyong Park , Hongju Kim , Ansook Sul , Seok Heo , Yinghu Xu
IPC: B01F23/10 , B01F23/231 , B01F101/56
Abstract: A chemical solution vaporization device includes a chemical solution tank including chemical solution vaporization rooms, a chemical solution sensing room, and a chemical solution supply room. A first internal wall separating the plurality of chemical solution vaporization rooms from each other includes a first opening at a lower portion thereof. A second internal wall separating at least one of the plurality of chemical solution vaporization rooms from the chemical solution supply room includes a second opening at a lower portion thereof. A third internal wall separating at least one of the plurality of chemical solution vaporization rooms from the chemical solution sensing room includes a third opening at a lower portion thereof. And a lower portion of a fourth internal wall separating the chemical solution sensing room from the chemical solution supply room is combined with the lower wall.
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