公开(公告)号：US11037760B2

公开(公告)日：2021-06-15

申请号：US16226786

申请日：2018-12-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hak-Young Kim ,  Bi-Ah Shin ,  Bo-Ra Yoon ,  Jun-Ho Im

IPC: C23C16/00 ,  H01L21/306 ,  H01J37/32 ,  F28F3/04 ,  G01K1/143

Abstract: A temperature controller of a plasma processing apparatus, a temperature measurer for a plasma processing apparatus, and a plasma processing apparatus, the temperature controller including a movable cooling plate configured to selectively contact a dielectric window in a plasma chamber, the cooling plate having at least one cooling groove through which a cooling agent for cooling the dielectric window is flowable; at least one cooling port including a cooling passageway that is connected to the at least one cooling groove; and a resilient member configured to resiliently press the cooling port toward the cooling plate such that the cooling plate is relatively movable with respect to the dielectric window.

公开(公告)号：US10665490B2

公开(公告)日：2020-05-26

申请号：US16240230

申请日：2019-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ja-Woo Lee ,  Keon-Woo Kim ,  Sun-Ho Kim ,  Eung-Su Kim ,  Bo-Ra Yoon ,  Hyan-Jung Lee ,  Tae-Il Cho

IPC: H01L21/68 ,  H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683

Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.

公开(公告)号：US20200013657A1

公开(公告)日：2020-01-09

申请号：US16240230

申请日：2019-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ja-Woo Lee ,  Keon-Woo Kim ,  Sun-Ho Kim ,  Eung-Su Kim ,  Bo-Ra Yoon ,  Hyan-Jung Lee ,  Tae-Il Cho

IPC: H01L21/68 ,  H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683

Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.