公开(公告)号：US20180164227A1

公开(公告)日：2018-06-14

申请号：US15800338

申请日：2017-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taejoong KIM ,  Kwang Soo KIM ,  lwa YOICHIRO ,  Byeonghwan JEON ,  Yougduk KIM ,  Wansung PARK ,  Tae-Heung AHN ,  Jaechol JOO

IPC: G01N21/94 ,  G01B11/06

CPC classification number: G01N21/94 ,  G01B11/06 ,  G01N21/9501 ,  G01N21/956

Abstract: Disclosed is a substrate inspection system. The substrate inspection system comprises a substrate inspection apparatus that inspects a substrate by irradiating light thereto. The substrate inspection apparatus comprises a light source to irradiate light onto the substrate, a detector to receive light from the substrate, and a controller to control an inspection mode of the substrate inspection apparatus by controlling the light source and the detector. The inspection mode comprises a first inspection mode to inspect whether a particle is present on the substrate and a second inspection mode to inspect a thickness of the substrate.

公开(公告)号：US20180150057A1

公开(公告)日：2018-05-31

申请号：US15724758

申请日：2017-10-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Janghee LEE ,  Yoo Jin JEONG ,  Sangbong PARK ,  Byeonghwan JEON

IPC: G05B19/4097 ,  G01N21/95 ,  H01L21/67 ,  H01L21/66 ,  G03F7/20

Abstract: An inspection device includes a first processor, a second processor, and a server. The first processor detects first coordinates of first feature points from first images in a first image set. The second processor detects second coordinates of second feature points from second images in a second image set. The server generates reference coordinates based on the first coordinates and the second coordinates. The reference coordinates are transmitted to the first processor and the second processor. The first and second image sets correspond to scanned swaths on a wafer.