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公开(公告)号：US20180164227A1
公开(公告)日：2018-06-14
申请号：US15800338
申请日：2017-11-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Taejoong KIM , Kwang Soo KIM , lwa YOICHIRO , Byeonghwan JEON , Yougduk KIM , Wansung PARK , Tae-Heung AHN , Jaechol JOO
CPC classification number: G01N21/94 , G01B11/06 , G01N21/9501 , G01N21/956
Abstract: Disclosed is a substrate inspection system. The substrate inspection system comprises a substrate inspection apparatus that inspects a substrate by irradiating light thereto. The substrate inspection apparatus comprises a light source to irradiate light onto the substrate, a detector to receive light from the substrate, and a controller to control an inspection mode of the substrate inspection apparatus by controlling the light source and the detector. The inspection mode comprises a first inspection mode to inspect whether a particle is present on the substrate and a second inspection mode to inspect a thickness of the substrate.
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Patent Agency Ranking
公开(公告)号：US20240167806A1
公开(公告)日：2024-05-23
申请号：US18232673
申请日：2023-08-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seungwoo LEE , Jinwoo AHN , Taejoong KIM , Myungjun LEE
IPC: G01B9/02 , G01B9/02015
CPC classification number: G01B9/02043 , G01B9/02032
Abstract: Provided is a pupil image measuring device including a light source configured to generate and output a light, a stage on which a measurement target is loaded, an optical system configured to transmit the light output from the light source, to the measurement target, a detector configured to detect a light reflected from the measurement target, and a spatial light distribution controller configured to adjust an intensity or amount of the light output from the light source or the reflected light, for each space of a plurality of spaces of the spatial light distribution controller, wherein the spatial light distribution controller is disposed on a pupil plane.
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公开(公告)号：US20250044222A1
公开(公告)日：2025-02-06
申请号：US18767486
申请日：2024-07-09
Applicant: SAMSUNG ELECTRONICS CO., LTD
Inventor： Seungwoo LEE , Jinseob KIM , Jinyong KIM , Taejoong KIM , Jinwoo AHN , Jaehwang JUNG , Taeyong JO , Garam CHOI
Abstract: An image measurement device includes an optical system that transmits light output to an image detection unit, the image detection unit configured to detect the light and generate an image, and an image processing unit that extracts spectral data from the image, wherein the image processing unit generates a profile according to an amount of light for each of a plurality of pixels based on the image, and performs Fourier transform on the profile.
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公开(公告)号：US20250045870A1
公开(公告)日：2025-02-06
申请号：US18766740
申请日：2024-07-09
Applicant: SAMSUNG ELECTRONICS CO., LTD
Inventor： Seungwoo LEE , Jinseob KIM , Jinyong KIM , Taejoong KIM
Abstract: An image measurement device includes an optical system that transmits light output to an image detection unit, the image detection unit configured to detect the light and generate an image, and an image processing unit that extracts spectral data from the image, wherein the image processing unit generates a profile according to an amount of light for each of a plurality of pixels based on the image, and performs Fourier transform on the profile.
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公开(公告)号：US20230207356A1
公开(公告)日：2023-06-29
申请号：US17980723
申请日：2022-11-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seungbeom PARK , Seunghwa HYUN , Kijoo HONG , Taejoong KIM , Youngkyu PARK
CPC classification number: H01L21/67259 , G03F7/7065 , G06T7/0004 , G06T7/70 , H01L21/67288 , H04N5/247 , H04N5/2256 , G06T2207/10056 , G06T2207/30148
Abstract: A wafer processing apparatus includes an X-θ stage unit having a rotary chuck capable of moving in an X direction and rotating in a θ direction, wherein a wafer is mounted on the rotary chuck and the wafer includes an edge portion adjacent to an edge of the wafer. In addition, the wafer processing apparatus includes: an edge bead removal (EBR) measurement and eccentricity measurement unit which is capable of inspecting a bead removal state of the edge portion of the wafer, and measuring eccentricity between the center of the rotary chuck and the center of the wafer; and an edge exposure of wafer (EEW) process unit which exposes the edge portion of the wafer after correcting the eccentricity between the center of the rotary chuck and the center of the wafer measured by the EBR measurement and eccentricity measurement unit.
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公开(公告)号：US20210341396A1
公开(公告)日：2021-11-04
申请号：US17116708
申请日：2020-12-09
Applicant: SAMSUNG ELECTRONICS CO., LTD
Inventor： Sungha KIM , Hyounggon KIM , Doohyun CHO , Kwangsung LEE , Jongsu KIM , Taejoong KIM , Jeongsu HA
Abstract: A thickness estimating apparatus includes a transfer robot, a light source, a camera, a memory and a controller. The memory stores a thickness predicting model generated based on a data set including a thickness of at least one of a test wafer corresponding to the wafer or a test element layer formed on the test wafer, and the thickness predicting model being trained to minimize a loss function of the data set. The controller applies pixel data, which is acquired from at least one pixel selected from a plurality of pixels included in a captured image, to the thickness predicting model, to predict a thickness of at least one of the wafer or an element layer formed on the wafer in a position corresponding to a position of the selected pixel.
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