公开(公告)号：US11840760B2

公开(公告)日：2023-12-12

申请号：US16207967

申请日：2018-12-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shin-Jae Kang ,  Dong-Hoon Han ,  Do-Hyung Kim ,  Kyung-Wook Park ,  Kevin Bae ,  Sun-Soo Lee ,  In-Jae Lee ,  Jeon-Il Lee ,  Chae-Mook Lim

IPC: C23C16/455 ,  H01L21/768 ,  H01L21/285 ,  C23C16/34

CPC classification number: C23C16/45544 ,  C23C16/34 ,  C23C16/45561 ,  H01L21/28562 ,  H01L21/76843

Abstract: In a layer deposition method, a substrate is loaded into a process chamber. A gas filling tank is charged with a gas to a predetermined charge pressure. The pressure of the gas is elevated to a pressure greater than the predetermined charge pressure. The gas is introduced into the process chamber.

公开(公告)号：US11251540B2

公开(公告)日：2022-02-15

申请号：US16092329

申请日：2017-02-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Soo Kim ,  Min-Chull Paik ,  Yongjun An ,  Sang Youn Lee ,  Hyoungjoo Lee ,  Dong-Hoon Han

IPC: H04B7/04 ,  H01Q21/28 ,  H01Q5/307 ,  H01P1/213 ,  H01Q1/24 ,  H01Q9/04 ,  H04B1/401 ,  H04B7/06 ,  H04B1/3827

Abstract: Various examples of the present invention relate to an apparatus and a method for controlling a connection and an operation of an antenna in an electronic device. Here, the electronic device comprises: a plurality of antenna units arranged in a first region thereof; at least one antenna unit arranged in a second region thereof; a communication circuit, which is connected to the plurality of antenna units arranged in the first region and to at least one antenna unit arranged in the second region; a first switch arranged in an electric path, which connects the plurality of antenna units with the communication circuit; and a second switch arranged in an electric path, which connects the at least one antenna unit with the communication circuit, wherein the first switch and the second switch can be configured to connect the plurality of antenna units with the communication circuit and the at least one antenna unit with the communication circuit, by using a first electric path and a second electric path for connecting the first switch and the second switch. Other examples are possible.

公开(公告)号：US11174549B2

公开(公告)日：2021-11-16

申请号：US16420725

申请日：2019-05-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sun-Cheul Kim ,  Kap-Soo Lee ,  Keun-Young Lee ,  Hong-Taek Lim ,  Jeong-Woo Hyun ,  Dong-Hoon Han

IPC: C23C16/02 ,  C23C16/44 ,  C23C16/50 ,  C23C16/06 ,  C23C16/34 ,  H01L21/285 ,  H01J37/32 ,  H01L27/11556 ,  H01L27/11582

Abstract: In a substrate processing method, a cleaning process is performed at a first temperature to remove a portion of a cumulative layer that is deposited within a chamber by deposition processes (step 1). The deposition processes are performed at the first temperature on a plurality of substrates within the chamber respectively (step 2). The step 1 and the step 2 are performed alternately and repeatedly.