HEAD-MOUNTED DISPLAY DEVICE
    5.
    发明申请
    HEAD-MOUNTED DISPLAY DEVICE 有权
    头安装显示设备

    公开(公告)号:US20160062125A1

    公开(公告)日:2016-03-03

    申请号:US14839609

    申请日:2015-08-28

    Abstract: A head-mounted display device is provided. The head-mounted display device includes: a frame having one surface formed to face a user's face; a wearing part formed to be coupled to at least a part of the frame so as to allow the frame to be fixed to the face; a mounting part formed in a cavity structure so that an external electronic device is capable of being mounted on the other surface of the frame; and one or more fastening parts that fix the external electronic device to the mounting part, wherein the fastening parts has an inclined opening angle.

    Abstract translation: 提供了一种头戴式显示装置。 头戴式显示装置包括:具有形成为面向使用者脸部的一个表面的框架; 磨损部,其形成为联接到所述框架的至少一部分,以允许所述框架固定到所述面部; 安装部,其形成为空腔结构,使得外部电子装置能够安装在所述框架的另一个表面上; 以及将外部电子装置固定在安装部上的一个以上的紧固部,其中,所述紧固部具有倾斜的开放角度。

    PROTECTIVE COVER AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    PROTECTIVE COVER AND MANUFACTURING METHOD THEREOF 审中-公开
    保护罩及其制造方法

    公开(公告)号:US20160249731A1

    公开(公告)日:2016-09-01

    申请号:US15056151

    申请日:2016-02-29

    Abstract: A method of manufacturing a protective cover for an electronic device is disclosed. The method includes forming an inner skin by blanking, blanking an outer skin of a fabric member in a shape corresponding to the blanked inner skin, forming a preform of a protective cover by laminating the inner skin and the outer skin with each other, thermo-compressing the laminated preform along an outer peripheral edge of the protective cover and forming the protective cover by cutting at least a portion of a region where the preform is thermo-compressing by the blanking.

    Abstract translation: 公开了一种制造电子设备用保护罩的方法。 该方法包括通过消隐来形成内皮,以对应于被冲切的内皮的形状冲切织物的外皮,通过将内皮和外皮相互层压形成保护罩的预成型件, 沿着保护盖的外周边缘压缩层叠的预制件,并通过切割预成型件通过冲裁来热压缩的区域的至少一部分来形成保护盖。

    Electronic device and method for communication connection based on low energy in electronic device

    公开(公告)号:US11497072B2

    公开(公告)日:2022-11-08

    申请号:US16917990

    申请日:2020-07-01

    Abstract: According to an embodiment, an electronic device may include a Bluetooth communication circuit and at least one processor. The at least one processor may be configured to: perform a first communication connection based on a first Bluetooth communication with a first audio electronic device having a first Bluetooth address by using the Bluetooth communication circuit, receive, from a second audio electronic device having the first Bluetooth address, a second communication connection request based on the first Bluetooth communication while performing the first communication connection, transmit, to the second audio electronic device, a second communication connection request response signal including rejection information for the received second communication connection request by using the Bluetooth communication circuit due to the first communication connection, and transmit, to the first audio electronic device, a message related to the rejection information for the second communication connection request through the first communication connection. Other embodiments are possible.

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