公开(公告)号：US20240363493A1

公开(公告)日：2024-10-31

申请号：US18524812

申请日：2023-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Duckseoung KANG ,  Sangdeok KWON ,  Gibum KIM

IPC: H01L23/48 ,  H01L29/06 ,  H01L29/417 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775 ,  H01L29/786

CPC classification number: H01L23/481 ,  H01L29/0673 ,  H01L29/41733 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/775 ,  H01L29/78696

Abstract: A semiconductor device may include a semiconductor substrate, a channel pattern on a first surface of the semiconductor substrate, source/drain patterns on the first surface of the semiconductor substrate and on both sides of the channel pattern, a contact electrode electrically connected to the source/drain patterns, a lower wiring structure on the second surface of the semiconductor substrate, and a through via penetrating the semiconductor substrate and connecting the contact electrode and the lower wiring structure to each other. The lower wiring structure may include a first metal line connected to a first voltage, a second metal line connected to a second voltage, and an auxiliary electrode electrically connected to one of the first metal line and the second metal line. The auxiliary electrode may overlap and be insulated from an other of the first metal line and the second metal line.

公开(公告)号：US20250056897A1

公开(公告)日：2025-02-13

申请号：US18794027

申请日：2024-08-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Duckseoung KANG ,  Sangdeok KWON ,  Gibum KIM ,  Seungjae LEE

IPC: H01L27/02 ,  H01L27/06 ,  H01L29/06 ,  H01L29/78 ,  H01L29/861

Abstract: An integrated circuit device includes: a substrate including a first surface and a second surface that is opposite to the first surface; and a diode structure including: an upper semiconductor layer disposed on the first surface of the substrate and including a first dopant of a first conductivity type; a lower semiconductor layer disposed on the second surface of the substrate and including a second dopant of a second conductivity type that is different from the first conductivity type; and a first well region provided in a portion of the substrate that is between the upper semiconductor layer and the lower semiconductor layer, wherein the first well region is in contact with the upper semiconductor layer or the lower semiconductor layer.

公开(公告)号：US20240387624A1

公开(公告)日：2024-11-21

申请号：US18532576

申请日：2023-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Duckseoung KANG ,  Sangdeok KWON ,  Gibum KIM

IPC: H01L29/06 ,  H01L27/088 ,  H01L29/08 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775 ,  H01L29/786

Abstract: An integrated circuit device includes a substrate including a first surface and a second surface that are opposite to each other, a fin type active area extending from the first surface of the substrate in a first direction, a channel structure on an upper surface of the fin type active area and including a channel region, a source/drain region on the upper surface of the fin type active area, a gate line extending on the substrate in a second direction that is perpendicular to the first direction, disposed on the substrate, and surrounding the channel structure, and an isolation structure passing vertically through the substrate and the fin type active area and located at one side of the source/drain region, wherein the channel structure, the source/drain region, and the isolation structure are sequentially arranged in the first direction.