公开(公告)号：US11222786B2

公开(公告)日：2022-01-11

申请号：US16426117

申请日：2019-05-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin Shin ,  Woo-Mok Son ,  Nam-Hoon Lee ,  Dong-Eog Kim ,  Seung-Hun Oh ,  Eun-Seok Lee ,  Young-Seok Jang

IPC: H01L21/304 ,  H01L21/02 ,  H01L21/66 ,  B24B37/10 ,  B24B49/02 ,  B24B37/013 ,  B24B37/04 ,  B24B49/10

Abstract: In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.

公开(公告)号：US09772296B2

公开(公告)日：2017-09-26

申请号：US14460814

申请日：2014-08-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung-Bok Kang ,  Seok-Min Kang ,  Bon-Ok Koo ,  Kyoung-Hwan Kim ,  Myung-Woo Kim ,  In-Gi Kim ,  Hyun-Chul Kim ,  Sung-Ki Roh ,  Gyung-Jin Min ,  Eun-Seok Lee ,  Jin-Suk Hong

IPC: G01N21/95 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/8851 ,  G01N2021/8887

Abstract: In a method of inspecting a surface of a substrate, a first surface image of the substrate before loaded into a process chamber may be obtained. The first surface image may be processed to detect a defect on the surface of the substrate. Thus, the surfaces of all of the substrate may be inspected during a process may be performed without transferring the substrates.

公开(公告)号：US11735427B2

公开(公告)日：2023-08-22

申请号：US17544990

申请日：2021-12-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin Shin ,  Woo-Mok Son ,  Nam-Hoon Lee ,  Dong-Eog Kim ,  Seung-Hun Oh ,  Eun-Seok Lee ,  Young-Seok Jang

IPC: H01L21/304 ,  H01L21/02 ,  H01L21/66 ,  B24B37/10 ,  B24B49/02 ,  B24B37/013 ,  B24B37/04 ,  B24B49/10

CPC classification number: H01L21/304 ,  H01L21/02013 ,  H01L22/12 ,  B24B37/013 ,  B24B37/042 ,  B24B37/10 ,  B24B49/02 ,  B24B49/10

Abstract: In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.

公开(公告)号：US10340158B2

公开(公告)日：2019-07-02

申请号：US15058277

申请日：2016-03-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun-Seok Lee ,  Chang-Gil Ryu ,  Geun-Young Song ,  Jae-Chang Lee ,  Yun-Seok Choi ,  Jin-Suk Hong

IPC: H01L21/67 ,  B08B3/10 ,  B08B1/04 ,  B08B3/02 ,  B05B1/20 ,  B05B13/04 ,  B08B1/00

Abstract: Provided is a substrate cleaning apparatus including: a cleaning bath configured to accommodate a substrate having a first surface and a second surface; a substrate support configured to support the substrate; first and second nozzle bars provided in the cleaning bath to be rotatable in a plane parallel with the substrate, each of the first and the second nozzle bars including a passage; a plurality of nozzles provided along a longitudinal direction of each of the first and the second nozzle bars and configured to spray the cleaning solution from the passage of each of the first and the second nozzle bars to the substrate; and first and second brushes, the first brush provided on a first side of the substrate and configured to clean the first surface and the second brush provided on a second side of the substrate and configured to clean the second surface of the substrate.