公开(公告)号：US20150380267A1

公开(公告)日：2015-12-31

申请号：US14706975

申请日：2015-05-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Je-Woo HAN ,  Gyung-Jin MIN

IPC: H01L21/311 ,  H01L21/3065 ,  H01L21/308

CPC classification number: H01L21/31144 ,  H01J37/32091 ,  H01J37/3244 ,  H01L21/31122 ,  H01L21/76814 ,  H01L21/76897

Abstract: In a method of removing a hard mask, a hard mask is formed on a substrate. A first plasma treatment is performed on the hard mask at a first temperature. A second plasma treatment is performed on the hard mask at a second temperature higher than the first temperature.

Abstract translation: 在去除硬掩模的方法中，在基板上形成硬掩模。 在第一温度下对硬掩模进行第一等离子体处理。 在比第一温度高的第二温度下对硬掩模进行第二等离子体处理。

公开(公告)号：US20150116698A1

公开(公告)日：2015-04-30

申请号：US14460814

申请日：2014-08-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung-Bok KANG ,  Seok-Min KANG ,  Bon-Ok KOO ,  Kyoung-Hwan KIM ,  Myung-Woo KIM ,  In-Gi KIM ,  Hyun-Chul KIM ,  Sung-Ki ROH ,  Gyung-Jin MIN ,  Eun-Seok LEE ,  Jin-Suk HONG

IPC: G01N21/95 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/8851 ,  G01N2021/8887

Abstract: In a method of inspecting a surface of a substrate, a first surface image of the substrate before loaded into a process chamber may be obtained. The first surface image may be processed to detect a defect on the surface of the substrate. Thus, the surfaces of all of the substrate may be inspected during a process may be performed without transferring the substrates.

Abstract translation: 在检查基板的表面的方法中，可以获得在加载到处理室之前的基板的第一表面图像。 可以处理第一表面图像以检测基板表面上的缺陷。 因此，可以在不转移基板的情况下执行处理期间所有基板的表面。