公开(公告)号：US20130316628A1

公开(公告)日：2013-11-28

申请号：US13787028

申请日：2013-03-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-Seok JANG ,  Young-Ho KOH ,  Jae-Sun KIM ,  Kuen-Byul KIM ,  Jae-Chang LEE ,  Min-Sung HEO ,  Jin-Suk HONG ,  Jae-Dong LEE

IPC: B24B37/30

CPC classification number: B24B37/30

Abstract: A flexible membrane for a polishing head includes a main part having a first surface configured to make contact with a surface of a substrate and a second surface opposite to the first surface, a plurality of extensions extending substantially perpendicularly from the second surface of the main part so as to define a plurality of independent spaces, respectively, and an inner ring coupled with an inner side of an outermost extension of the extensions to support an edge portion of the main part. A bottom surface of the inner ring is substantially flat.

Abstract translation: 一种用于抛光头的柔性膜包括：主要部分，其具有构造成与基板的表面接触的第一表面和与第一表面相对的第二表面;多个延伸部，从主要部分的第二表面基本垂直延伸; 以便分别限定多个独立空间，以及与所述延伸部的最外延伸部的内侧联接的内环，以支撑主要部分的边缘部分。 内圈的底面基本上是平的。

公开(公告)号：US20160236318A1

公开(公告)日：2016-08-18

申请号：US15001410

申请日：2016-01-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun-Seok CHOI ,  Chang-Gil RYU ,  Geun-Young SONG ,  Ki-Yeon CHU ,  Jin-Suk HONG

IPC: B24B37/32

CPC classification number: B24B37/32 ,  B24B37/30 ,  B24B55/02

Abstract: A polishing head includes a substrate carrier to suck and to pressurize a substrate, and a retainer ring secured under the substrate carrier, the retainer ring surrounding a circumference of the substrate and including a cooling channel therethrough to circulate a coolant fluid.

Abstract translation: 抛光头包括用于吸附和加压基板的基板载体，以及固定在基板载体下方的保持环，保持环围绕基板的圆周并且包括通过其的冷却通道以循环冷却剂流体。

公开(公告)号：US20150116698A1

公开(公告)日：2015-04-30

申请号：US14460814

申请日：2014-08-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung-Bok KANG ,  Seok-Min KANG ,  Bon-Ok KOO ,  Kyoung-Hwan KIM ,  Myung-Woo KIM ,  In-Gi KIM ,  Hyun-Chul KIM ,  Sung-Ki ROH ,  Gyung-Jin MIN ,  Eun-Seok LEE ,  Jin-Suk HONG

IPC: G01N21/95 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/8851 ,  G01N2021/8887

Abstract: In a method of inspecting a surface of a substrate, a first surface image of the substrate before loaded into a process chamber may be obtained. The first surface image may be processed to detect a defect on the surface of the substrate. Thus, the surfaces of all of the substrate may be inspected during a process may be performed without transferring the substrates.

Abstract translation: 在检查基板的表面的方法中，可以获得在加载到处理室之前的基板的第一表面图像。 可以处理第一表面图像以检测基板表面上的缺陷。 因此，可以在不转移基板的情况下执行处理期间所有基板的表面。