公开(公告)号：US20230199953A1

公开(公告)日：2023-06-22

申请号：US18107129

申请日：2023-02-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bongsoo KIM ,  Gyeongmin JIN ,  Hakjoon KIM ,  Jaebum LEE

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K3/3436 ,  H05K2201/099

Abstract: An electronic device according to an embodiment may include: a Printed Circuit Board (PCB) including a first face and a second face; a semiconductor chip mounted on the second face; a conductive pad disposed on the second face; a solder resist layer disposed on the second face and including an aperture; an arc-shaped opening having an inner diameter and an outer diameter, disposed along an outer periphery of the conductive pad and in the aperture; and at least one external terminal disposed on the semiconductor chip and bonded to the conductive pad. The conductive pad may include: a first region having a smaller diameter than the outer diameter; and at least one second region extending from the first region in a first outer circumferential direction, and located at least in part between both ends of the opening. In addition, various embodiments recognized through the specification may also be possible.

公开(公告)号：US20230171535A1

公开(公告)日：2023-06-01

申请号：US18101271

申请日：2023-01-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kibum KIM ,  Jinsu KIM ,  Seokjoon PARK ,  Hakjoon KIM

IPC: H04R1/28 ,  H05K9/00 ,  H04R3/00 ,  H04R1/02

CPC classification number: H04R1/2826 ,  H05K9/0024 ,  H04R3/00 ,  H04R1/025 ,  H04R1/028 ,  H04R2400/11 ,  H04R2499/11 ,  H04M1/0277

Abstract: The electronic device may include: a housing; a printed circuit board (PCB) disposed in the housing, the PCB including a first board surface facing a first direction and a second board surface opposite to the first board surface, and having an opening penetrating through a surface thereof, a sound module disposed in the opening so that a front thereof faces the first direction, and electrically connected to the PCB to generate a sound, a shield can connected to the second board surface to cover the opening, in a state in which the second board surface is viewed, and a frame disposed to face the first board surface.

公开(公告)号：US20220408003A1

公开(公告)日：2022-12-22

申请号：US17841384

申请日：2022-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chiho CHOI ,  Hakjoon KIM ,  Jungmin YANG

IPC: H04N5/235 ,  H04N5/232 ,  G06T5/00 ,  G06T5/50

Abstract: According to various embodiments, an electronic device may comprise: a power converter; a camera module including a camera; and a processor configured to: identify a first illuminance value of a surrounding of the electronic device in a state in which a switching frequency of the power converter transferring power to the camera module is a first frequency; determine whether the first illuminance value meets a first reference; and set the switching frequency of the power converter to a second frequency different from the first frequency based on the first illuminance value meeting the first reference.