公开(公告)号：US20250003812A1

公开(公告)日：2025-01-02

申请号：US18810429

申请日：2024-08-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaebum LEE ,  Hyunggwang KANG ,  Youngho KIM ,  Junho LEE ,  Seokmin JANG ,  Hyunju HONG

IPC: G01K13/06 ,  G01K7/22

Abstract: An electronic device according to various embodiments of the disclosure may include a first housing, a second housing configured to be slid into the first housing and slid out from the first housing, a substrate part disposed between the front surface and the rear surface in the first housing and including at least one heat source, a first temperature sensor disposed on the substrate part, a second temperature sensor disposed in the second housing, and at least one processor. The at least one processor is configured to calculate a temperature of the electronic device based on at least one of a measurement value of the first temperature sensor or a measurement value of the second temperature sensor. Various other embodiments may be possible.

公开(公告)号：US20240255585A1

公开(公告)日：2024-08-01

申请号：US18633892

申请日：2024-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunglak KIM ,  Yongyeon KIM ,  Hyeongki NAM ,  Sungho PARK ,  Jaebum LEE

IPC: G01R31/55 ,  G01R19/165 ,  H02H1/00 ,  H02H3/12 ,  H05K1/14

CPC classification number: G01R31/55 ,  G01R19/16533 ,  H02H1/0092 ,  H02H3/12 ,  H05K1/14 ,  H05K2201/10098

Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed inside the housing and including a first antenna, a first connector connected to the first antenna, a second antenna, and a second connector connected to the second antenna, memory storing one or more computer programs, a second printed circuit board spaced apart from the first printed circuit board inside the housing and including a power management circuit, a third connector electrically connected to the first connector, a fourth connector electrically connected to the second connector, a first detection circuit, and one or more processors communicatively coupled to the first detection circuit and the memory, a first cable electrically connecting the first connector and the third connector, and a second cable electrically connecting the second connector and the fourth connector, wherein the first detection circuit includes a first resistor disposed between the one or more processors and the power management circuit, and the first printed circuit board includes a second resistor branched between the first antenna and the first connector and electrically connected to the ground, and a third resistor branched between the second antenna and the second connector and electrically connected to the ground.

公开(公告)号：US20230199953A1

公开(公告)日：2023-06-22

申请号：US18107129

申请日：2023-02-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bongsoo KIM ,  Gyeongmin JIN ,  Hakjoon KIM ,  Jaebum LEE

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K3/3436 ,  H05K2201/099

Abstract: An electronic device according to an embodiment may include: a Printed Circuit Board (PCB) including a first face and a second face; a semiconductor chip mounted on the second face; a conductive pad disposed on the second face; a solder resist layer disposed on the second face and including an aperture; an arc-shaped opening having an inner diameter and an outer diameter, disposed along an outer periphery of the conductive pad and in the aperture; and at least one external terminal disposed on the semiconductor chip and bonded to the conductive pad. The conductive pad may include: a first region having a smaller diameter than the outer diameter; and at least one second region extending from the first region in a first outer circumferential direction, and located at least in part between both ends of the opening. In addition, various embodiments recognized through the specification may also be possible.