公开(公告)号：US20210161034A1

公开(公告)日：2021-05-27

申请号：US16952595

申请日：2020-11-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chihwan JEONG ,  Kyungha KOO ,  Jihong KIM ,  Dongku KANG ,  Kuntak KIM ,  Yunjeong PARK ,  Kyuhwan LEE ,  Haejin LEE ,  Seyoung JANG ,  Hyuntae JANG

IPC: H05K7/20 ,  H02J7/02 ,  H02J7/00 ,  H02J50/10

Abstract: The disclosure relates to a wireless charging device including a cooling fan, and the wireless charging device according to an embodiment of the disclosure includes: a housing including a holding portion configured to hold an external electronic device; a first bracket positioned in the holding portion; a conductive coil disposed in the first bracket; a second bracket positioned in the holding portion and including a penetrating hole; a first cooling fan positioned in the penetrating hole; a second cooling fan positioned in the penetrating hole and spaced apart from the first cooling fan; and a partition formed in the penetrating hole to isolate the first cooling fan and the second cooling fan from each other, the penetrating hole being divided into a first area having the first cooling fan disposed therein and a second area having the second cooling fan positioned therein, at least one protrusion having a volute shape formed on at least a portion of the second bracket or at least a portion of the partition, a first opening formed on at least an area of the first bracket to allow air cooled by the first cooling fan and/or the second cooling fan to move to the holding portion, and a second opening formed on at least an area of the holding portion to allow the air transmitted from the first opening to move outside the wireless charging device.

公开(公告)号：US20220107674A1

公开(公告)日：2022-04-07

申请号：US17554389

申请日：2021-12-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heetae KIM ,  Kuntak KIM ,  Mansu YANG ,  Seungchul CHOI ,  Kyungha KOO ,  Soongyu KWON ,  Soohyun MOON ,  Kyungsoo SEO ,  Myungkee LEE ,  Jihwan LIM ,  Hyuntae JANG ,  Kyejeong JEONG

IPC: G06F1/20 ,  G06F1/3296 ,  G06F1/324

Abstract: A method of an electronic device are provided in which current consumption for one or more components of the electronic device is compared with a predetermined current. A first surface temperature of the electronic device is determined based on the comparison and power consumption of the one or more components. A location is detected where heat corresponding to the first surface temperature is generated. A second surface temperature of the electronic device is obtained based on power consumption of a component disposed in the electronic device corresponding to the location where the heat is generated. A target temperature is set based on the obtained second surface temperature. The component is controlled to reduce the power consumption of the component based on the target temperature.

公开(公告)号：US20210373625A1

公开(公告)日：2021-12-02

申请号：US15734060

申请日：2020-09-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungha KOO ,  Kuntak KIM ,  Hajoong YUN ,  Seungjoo LEE ,  Seyoung JANG ,  Hyuntae JANG

IPC: G06F1/20 ,  G05B15/02 ,  G06F9/50 ,  G05D23/19

Abstract: An electronic device and method of operating an electronic device are provided. The electronic device includes a temperature measurement unit configured to measure a temperature of each of multiple components of the electronic device, and a controller configured to change, based on a first reference temperature, an operating frequency of the controller to a first operating frequency when a temperature of the controller, measured by the temperature measurement unit, reaches the first reference temperature and change, based on a third reference temperature that is lower than the first reference temperature, the operating frequency of the controller to a second operating frequency when a temperature of at least one component of the multiple components reaches a second reference temperature while the controller operates at the first operating frequency.

公开(公告)号：US20200321229A1

公开(公告)日：2020-10-08

申请号：US16761905

申请日：2018-12-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjoon LEE ,  Byunghoon LEE ,  Min PARK ,  Kyungwoon JANG ,  Jeonggen YOON ,  Hyuntae JANG

IPC: H01L21/67 ,  H01L25/075 ,  B65G47/90

Abstract: Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.