公开(公告)号：US20210035830A1

公开(公告)日：2021-02-04

申请号：US16821415

申请日：2020-03-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwangnam KIM ,  Nohsung KWAK ,  Sungyeon KIM ,  Hyungjun KIM ,  Haejoong PARK ,  Jongwoo SUN ,  Sangrok OH ,  Ilyoung HAN ,  Jungpyo HONG

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/673 ,  H01L21/677

Abstract: A semiconductor manufacturing apparatus including at least one load module including a load port on which a substrate container is located, a plurality of substrates being mountable on the substrate container; at least one loadlock module including a loadlock chamber directly connected to the substrate container, the loadlock chamber interchangeably having atmospheric pressure and vacuum pressure, a first transfer robot within the loadlock chamber, and a substrate stage within the loadlock chamber, the plurality of substrates being mountable on the substrate stage; a transfer module including a transfer chamber connected to the loadlock chamber, a second transfer robot within the transfer chamber, and a substrate aligner within the transfer chamber; and at least one process module including at least one process chamber connected to the transfer module.

公开(公告)号：US20200373274A1

公开(公告)日：2020-11-26

申请号：US16783342

申请日：2020-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung HAN ,  Taeyeong KIM ,  Jihoon KANG ,  Nohsung KWAK ,  Seokho KIM ,  Hoechul KIM ,  Ilhyoung LEE ,  Hakjun LEE

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/687 ,  H01L21/67

Abstract: A substrate bonding apparatus for bonding a first substrate to a second substrate includes: a first bonding chuck including: a first base; a first deformable plate provided on the first base to support the first substrate; and a first pneumatic adjustor configured to deform the first deformable plate by adjusting a first pressure in a first cavity formed between the first deformable plate and the first base; and a second bonding chuck including: a second base; a second deformable plate provided on the second base to support the second substrate; and a second pneumatic adjustor configured to deform the second deformable plate by adjusting a second pressure in a second cavity formed between the second deformable plate and the second base. The first deformable plate is deformed such that a first distance between the first base and the first deformable plate is varied based on the first pressure, and the second deformable plate is deformed such that a second distance between the second base the second deformable plate is varied based on the second pressure.

公开(公告)号：US20250140588A1

公开(公告)日：2025-05-01

申请号：US18790371

申请日：2024-07-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung HAN ,  Sumin KIM ,  Minwoo RHEE ,  Hyunjin LEE ,  Kyeongbin LIM

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/68

Abstract: A wafer on which a hydrophilic pattern is applied is provided to a die seat on which a first magnetic pattern is formed and a hydrophobic pattern is applied around the hydrophilic pattern. Liquid is dispensed to the die seat. A first die on which a second magnetic pattern is formed is seated on the wafer and the first die is first-aligned using capillary force of the liquid. Liquid is dispensed onto an upper surface of the first die. A second die is seated on the upper surface of the first die and the second die is first-aligned with capillary force of the liquid on the upper surface of the first die. A magnetic field is generated in the first magnetic pattern and the second magnetic pattern and the first magnetic pattern and the second magnetic pattern are secondly-aligned using magnetic force.

公开(公告)号：US20210358778A1

公开(公告)日：2021-11-18

申请号：US17078190

申请日：2020-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung HAN ,  Kyoungran KIM ,  Chulhyun PARK ,  Minjae SHIN ,  Geunsik OH ,  Hyunjin LEE ,  Soonwon LEE ,  Nungpyo HONG

IPC: H01L21/67 ,  H01L21/683 ,  H01L23/00

Abstract: A substrate debonding apparatus configured to separate a support substrate attached to a first surface of a device substrate by an adhesive layer, the substrate debonding apparatus including a substrate chuck configured to support a second surface of the device substrate, the second surface being opposite to the first surface of the device substrate; a light irradiator configured to irradiate light to an inside of the adhesive layer; and a mask between the substrate chuck and the light irradiator, the mask including an opening through which an upper portion of the support substrate is exposed, and a first cooling passage or a second cooling passage, the first cooling passage being configured to provide a path in which a coolant is flowable, the second cooling passage being configured to provide a path in which air is flowable and to provide part of the air to a central portion of the opening.

公开(公告)号：US20230253236A1

公开(公告)日：2023-08-10

申请号：US18135017

申请日：2023-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ilyoung HAN ,  Hunyong PARK ,  Sohee HAN ,  Nohsung KWAK

IPC: H01L21/687

CPC classification number: H01L21/68742 ,  H01L21/68785

Abstract: The present disclosure is related to a substrate processing apparatus. The substrate processing apparatus may include a chuck including a plurality of pin holes and a plurality of lift pins positioned to rise and fall through the plurality of pin holes. The substrate processing apparatus may include a lift plate configured to raise and lower the lift pins. The plurality of lift pins may include a lift pin having a rod shape configured to move up and down in a pin hole of the plurality of pin holes, a flexure coupled to a lower portion of the lift pin, a weight body positioned underneath the lift plate, and a weight string connecting the flexure and the weight body. The lift plate may include a string hole through which the weight string passes through.

公开(公告)号：US20210005504A1

公开(公告)日：2021-01-07

申请号：US16712413

申请日：2019-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ilyoung HAN ,  Hunyong PARK ,  Sohee HAN ,  Nohsung KWAK

IPC: H01L21/687

Abstract: The present disclosure is related to a substrate processing apparatus. The substrate processing apparatus may include a chuck including a plurality of pin holes and a plurality of lift pins positioned to rise and fall through the plurality of pin holes. The substrate processing apparatus may include a lift plate configured to raise and lower the lift pins. The plurality of lift pins may include a lift pin having a rod shape configured to move up and down in a pin hole of the plurality of pin holes, a flexure coupled to a lower portion of the lift pin, a weight body positioned underneath the lift plate, and a weight string connecting the flexure and the weight body. The lift plate may include a string hole through which the weight string passes through.