SEMICONDUCTOR DEVICE
    3.
    发明申请

    公开(公告)号:US20200209733A1

    公开(公告)日:2020-07-02

    申请号:US16815219

    申请日:2020-03-11

    Abstract: A method for fabricating a phase shift mask includes preparing a transmissive substrate on which a first mask region and a second mask region surrounding the first mask region are defined. In the first mask region, main patterns are formed having a first pitch in a first direction and a second direction perpendicular to the first direction. Each of the main patterns has a first area. In at least one row, assist patterns are formed at the first pitch to surround the main patterns. Each of the assist patterns has a second area less than the first area. In the second mask region, dummy patterns are formed in a plurality of rows. The dummy patterns surround the assist patterns at the first pitch. Each of the dummy patterns has a third area greater than the first area.

    PHOTOMASK FOR NEGATIVE-TONE DEVELOPMENT
    4.
    发明申请

    公开(公告)号:US20200089100A1

    公开(公告)日:2020-03-19

    申请号:US16564779

    申请日:2019-09-09

    Abstract: A photomask for negative-tone development (NTD) includes a main region, and a scribe lane region surrounding the main region and including a first lane and a second lane. The first and the second lane is provided at first opposite sides of each other with respect to the main region. The first lane includes a first sub-lane extending in a first direction and a second sub-lane that extending in the first direction. The first sub-lane includes a first dummy pattern and the second sub-lane includes a second dummy pattern. The first dummy pattern and the second dummy pattern are configured to radiate light exceeding a threshold dose of light to a first portion of a negative-tone photoresist provided under the first lane of the photomask.

    METHOD OF FABRICATING PHASE SHIFT MASK AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE

    公开(公告)号:US20180341172A1

    公开(公告)日:2018-11-29

    申请号:US15865636

    申请日:2018-01-09

    Abstract: A method for fabricating a phase shift mask includes preparing a transmissive substrate on which a first mask region and a second mask region surrounding the first mask region are defined. In the first mask region, main patterns are formed having a first pitch in a first direction and a second direction perpendicular to the first direction. Each of the main patterns has a first area. In at least one row, assist patterns are formed at the first pitch to surround the main patterns. Each of the assist patterns has a second area less than the first area. In the second mask region, dummy patterns are formed in a plurality of rows. The dummy patterns surround the assist patterns at the first pitch. Each of the dummy patterns has a third area greater than the first area.

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