公开(公告)号：US20170077041A1

公开(公告)日：2017-03-16

申请号：US15236868

申请日：2016-08-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： JinGyu KIM ,  Taehun KIM ,  JiSun HONG ,  Byungmoon BAE ,  Se-Ho YOU

IPC: H01L23/552 ,  H01L23/528 ,  H01L23/29 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/293 ,  H01L23/49816 ,  H01L23/562 ,  H01L23/60 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16237 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/3511

Abstract: A package substrate includes a substrate including a circuit region, a dummy region surrounding the circuit region, and a lower circuit pattern at the dummy region, the circuit region including unit regions arranged in a matrix shape, and solders on the lower circuit pattern, at least one of the solders electrically connected to the lower circuit pattern.

Abstract translation: 封装基板包括：基板，其包括电路区域，围绕电路区域的虚设区域和虚设区域的下部电路图案，所述电路区域包括以矩阵形状排列的单位区域，以及位于下部电路图案上的焊料， 至少一个焊料电连接到较低电路图案。