公开(公告)号：US20170077041A1

公开(公告)日：2017-03-16

申请号：US15236868

申请日：2016-08-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： JinGyu KIM ,  Taehun KIM ,  JiSun HONG ,  Byungmoon BAE ,  Se-Ho YOU

IPC: H01L23/552 ,  H01L23/528 ,  H01L23/29 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/293 ,  H01L23/49816 ,  H01L23/562 ,  H01L23/60 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16237 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/3511

Abstract: A package substrate includes a substrate including a circuit region, a dummy region surrounding the circuit region, and a lower circuit pattern at the dummy region, the circuit region including unit regions arranged in a matrix shape, and solders on the lower circuit pattern, at least one of the solders electrically connected to the lower circuit pattern.

Abstract translation: 封装基板包括：基板，其包括电路区域，围绕电路区域的虚设区域和虚设区域的下部电路图案，所述电路区域包括以矩阵形状排列的单位区域，以及位于下部电路图案上的焊料， 至少一个焊料电连接到较低电路图案。

公开(公告)号：US20160013126A1

公开(公告)日：2016-01-14

申请号：US14746981

申请日：2015-06-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JinGyu KIM ,  Hyun LEE

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L24/97 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/367 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15151 ,  H01L2924/15331 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/85

Abstract: Provided are a package substrate and a method of fabricating a semiconductor package. The package substrate includes: a base substrate having a plurality of packaging unit regions arranged along rows and columns on one surface thereof; and a sink portion penetrating at least a portion of the base substrate from the one surface, in which the packaging unit regions may be disposed adjacent to a first side of the one surface and the sink portion may be disposed adjacent to a second side of the one surface.

Abstract translation: 提供一种封装基板和制造半导体封装的方法。 封装基板包括：基底基板，其具有沿着其一个表面上的行和列布置的多个封装单元区域; 以及从所述一个表面穿透所述基底基板的至少一部分的汇聚部分，其中所述包装单元区域可以邻近所述一个表面的第一侧设置，并且所述汇集部分可以设置在所述第一侧 一个表面。