公开(公告)号：US20160225669A1

公开(公告)日：2016-08-04

申请号：US14993054

申请日：2016-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inho CHOI ,  Donghan KIM ,  Jae Choon KIM ,  Jikho SONG ,  Mitsuo UMEMOTO

IPC: H01L21/78 ,  H01L23/00 ,  H01L21/768 ,  H01L21/56

CPC classification number: H01L21/78 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/3025 ,  H01L2924/3511

Abstract: A method of fabricating a semiconductor package is disclosed. The method includes disposing semiconductor chips on a support substrate, forming a protection layer covering top surfaces of the semiconductor chips, forming a molding layer covering the support substrate and the protection layer, and etching the molding layer to expose the protection layer.

Abstract translation: 公开了制造半导体封装的方法。 该方法包括将半导体芯片布置在支撑基板上，形成覆盖半导体芯片顶表面的保护层，形成覆盖支撑基板和保护层的模制层，以及蚀刻模塑层以露出保护层。

公开(公告)号：US20200372232A1

公开(公告)日：2020-11-26

申请号：US16989974

申请日：2020-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： WOONBAE KIM ,  Jikho SONG ,  Sungeun JO ,  Ji-Yong PARK ,  Jeong-Kyu HA

IPC: G06K9/00 ,  G09G3/3208

Abstract: Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.

公开(公告)号：US20190213373A1

公开(公告)日：2019-07-11

申请号：US16027620

申请日：2018-07-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woonbae KIM ,  Jikho SONG ,  Sungeun JO ,  Ji-Yong PARK ,  Jeong-Kyu HA

IPC: G06K9/00 ,  G09G3/3208

Abstract: Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.