公开(公告)号：US20240168693A1

公开(公告)日：2024-05-23

申请号：US18425638

申请日：2024-01-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sejun KIM ,  Kibo KIM ,  Jinsub KIM

IPC: G06F3/14

CPC classification number: G06F3/1446

Abstract: A multi-display device is configured to display an image, and the multi-display device includes display modules sequentially connected according to a prescribed connection configuration. Each of the display modules may include a signal input unit for acquiring an image signal and control information and a partial image selection unit for obtaining, from the control information, information about the connection configuration of the display modules, wherein each display module selects a partial image corresponding to the display module, from the image signal by referring to a first lookup table based on the information about the connection configuration.

公开(公告)号：US20230180472A1

公开(公告)日：2023-06-08

申请号：US18097592

申请日：2023-01-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung-Hee KIM ,  Woo Choel NOH ,  Ik Soo KIM ,  Jun Kwan KIM ,  Jinsub KIM ,  Yongjin SHIN

IPC: H10B41/46 ,  H10B41/10 ,  H10B41/20 ,  H10B43/10 ,  H10B43/20 ,  H10B43/40

CPC classification number: H10B41/46 ,  H10B41/10 ,  H10B41/20 ,  H10B43/10 ,  H10B43/20 ,  H10B43/40

Abstract: A semiconductor device including a substrate that includes a cell array region and a peripheral circuit region; a cell transistor on the cell array region of the substrate; a peripheral transistor on the peripheral circuit region of the substrate; a first interconnection layer connected to the cell transistor; a second interconnection layer connected to the peripheral transistor; an interlayer dielectric layer covering the first interconnection layer; and a blocking layer spaced apart from the first interconnection layer, the blocking layer covering a top surface and a sidewall of the second interconnection layer.

公开(公告)号：US20190206591A1

公开(公告)日：2019-07-04

申请号：US16239680

申请日：2019-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunwoo KIM ,  Hyunjung KOH ,  Jinsub KIM ,  Dongjin PARK ,  Woosub BANG ,  Changhun BAE ,  Sungki SON ,  Seungbok LEE ,  Jin LEE ,  Junghwa CHOI

IPC: H01B11/22 ,  H01B7/04 ,  G02B6/44

Abstract: An optical signal transferring apparatus, an electronic apparatus, and a source device, and methods of operating the same include a signal transfer unit including one or more signal lines transferring a signal between a first apparatus and a second apparatus and one or more power lines transferring power between the first apparatus and the second apparatus; and a first connector connected to the first apparatus, and a second connector connected to the second apparatus, wherein the signal transfer unit is configured to transfer an optical signal to the second apparatus in response to a power-on input of the first apparatus and transfer, to the first apparatus, power and data which are received from the second apparatus in response to detection of the transferred optical signal, respectively, via the one or more power lines and the one or more signal lines.

公开(公告)号：US20230048494A1

公开(公告)日：2023-02-16

申请号：US17737335

申请日：2022-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinsub KIM ,  Woosub BANG ,  Youngjin LEE

IPC: H01R12/89 ,  H01R12/70 ,  H01R12/77

Abstract: A display apparatus including: a display panel; a chassis assembly supporting the display panel; a printed circuit board accommodated in the chassis assembly, and configured to drive and control the display panel; and a connector installed on the printed circuit board, and including a seating portion and a connector terminal positioned on one side of the seating portion, wherein the connector is connected to the cable by seating a surface of a body of a cable on the seating portion in a vertical direction while the surface of the body of the cable faces the seating portion and contact-coupling a cable terminal formed at one end of the body of the cable with the connector terminal.

公开(公告)号：US20210375896A1

公开(公告)日：2021-12-02

申请号：US17099994

申请日：2020-11-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung-Hee KIM ,  Woo Choel NOH ,  Ik Soo KIM ,  Jun Kwan KIM ,  Jinsub KIM ,  Yongjin SHIN

IPC: H01L27/11539 ,  H01L27/11519 ,  H01L27/11551 ,  H01L27/11565 ,  H01L27/11573 ,  H01L27/11578

Abstract: A semiconductor device including a substrate that includes a cell array region and a peripheral circuit region; a cell transistor on the cell array region of the substrate; a peripheral transistor on the peripheral circuit region of the substrate; a first interconnection layer connected to the cell transistor; a second interconnection layer connected to the peripheral transistor; an interlayer dielectric layer covering the first interconnection layer; and a blocking layer spaced apart from the first interconnection layer, the blocking layer covering a top surface and a sidewall of the second interconnection layer.