INTEGRATED CIRCUIT DEVICES
    1.
    发明申请

    公开(公告)号:US20190097007A1

    公开(公告)日:2019-03-28

    申请号:US15914611

    申请日:2018-03-07

    Abstract: An integrated circuit device may include a pair of line structures. Each line structure may include a pair of conductive lines extending over a substrate in a first horizontal direction and a pair of insulating capping patterns respectively covering the pair of conductive lines. The integrated circuit device may include a conductive plug between the pair of line structures and a metal silicide film contacting a top surface of the conductive plug between the pair of insulating capping patterns. The conductive plug may have a first width between the pair of conductive lines and a second width between the pair of insulating capping patterns, in a second horizontal direction perpendicular to the first horizontal direction, where the second width is greater than the first width.

    SEMICONDUCTOR DEVICE INCLUDING DEVICE ISOLATION LAYER

    公开(公告)号:US20190355813A1

    公开(公告)日:2019-11-21

    申请号:US16217285

    申请日:2018-12-12

    Abstract: Provided are semiconductor devices including device isolation layers. The semiconductor device includes a substrate having a cell region and a core/peripheral region, a first active region in the cell region of the substrate, a first device isolation layer that defines the first active region, a second active region in the core/peripheral region of the substrate; and a second device isolation layer that defines the second active region. A height from a lower surface of the substrate to an upper end of the first device isolation layer in a first direction that is perpendicular to the lower surface of the substrate is less than or equal to a height from the lower surface of the substrate to an upper end of the first active region in the first direction.

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