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公开(公告)号:US20190097007A1
公开(公告)日:2019-03-28
申请号:US15914611
申请日:2018-03-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jun-hyeok AHN , Eun-jung Kim , Hui-jung Kim , Ki-seok Lee , Bong-soo Kim , Myeong-dong Lee , Sung-hee Han , Yoo-sang Hwang
IPC: H01L29/423 , H01L29/06 , H01L29/40 , H01L29/66 , H01L21/762 , H01L21/74
Abstract: An integrated circuit device may include a pair of line structures. Each line structure may include a pair of conductive lines extending over a substrate in a first horizontal direction and a pair of insulating capping patterns respectively covering the pair of conductive lines. The integrated circuit device may include a conductive plug between the pair of line structures and a metal silicide film contacting a top surface of the conductive plug between the pair of insulating capping patterns. The conductive plug may have a first width between the pair of conductive lines and a second width between the pair of insulating capping patterns, in a second horizontal direction perpendicular to the first horizontal direction, where the second width is greater than the first width.
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公开(公告)号:US20190355813A1
公开(公告)日:2019-11-21
申请号:US16217285
申请日:2018-12-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Se-myeong JANG , Jun-hyeok AHN , Bong-soo KIM , Hyo-bin PARK , Myoung-seob SHIM
IPC: H01L29/06 , H01L29/51 , H01L21/762
Abstract: Provided are semiconductor devices including device isolation layers. The semiconductor device includes a substrate having a cell region and a core/peripheral region, a first active region in the cell region of the substrate, a first device isolation layer that defines the first active region, a second active region in the core/peripheral region of the substrate; and a second device isolation layer that defines the second active region. A height from a lower surface of the substrate to an upper end of the first device isolation layer in a first direction that is perpendicular to the lower surface of the substrate is less than or equal to a height from the lower surface of the substrate to an upper end of the first active region in the first direction.
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