公开(公告)号：US12297385B2

公开(公告)日：2025-05-13

申请号：US17573734

申请日：2022-01-12

Applicant: Samsung Electronics Co., Ltd. ,  DONGWOO FINE-CHEM CO., LTD.

Inventor： Min Hyung Cho ,  Hyo Joong Yoon ,  Min Ju Im ,  Jung Min Oh ,  Sang Won Bae ,  Hyo San Lee

IPC: C09K13/00 ,  H01L21/3213 ,  H01L21/768

Abstract: Etching compositions are provided. The etching compositions can be used for etching cobalt. The etching compositions may include a chelator, water, an oxidizer, and an organic solvent, and the chelator may include an organic acid, an amine compound and/or a polyhydric alcohol. Water may be present in an amount of 1 wt % to 10 wt % based on a total weight of the etching composition.

公开(公告)号：US10435234B2

公开(公告)日：2019-10-08

申请号：US15814842

申请日：2017-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Jhin Cho ,  In Kwang Bae ,  Jung Min Oh ,  Mi Hyun Park ,  Kun Tack Lee ,  Yong Jun Choi

IPC: B05B5/025 ,  B05C11/10 ,  B65D85/00 ,  B65D90/46 ,  G01R29/24 ,  C09D5/24 ,  C08L27/20 ,  H01L21/67 ,  C08F14/26 ,  C08K3/04 ,  C08F14/22

Abstract: A chemical liquid supply apparatus includes a storage container configured to accommodate a chemical liquid for processing a semiconductor substrate, a chemical liquid supply pipe, a supply nozzle, and a grounding conductor. A conductive layer including a non-metallic conductive material is formed on an inner surface of the chemical liquid supply pipe. The supply nozzle includes a non-metallic conductive material. The conductive layer or the supply nozzle is electrically connected to the grounding conductor which is grounded to an outside of the pipe.

公开(公告)号：US20180334318A1

公开(公告)日：2018-11-22

申请号：US15814842

申请日：2017-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Jhin Cho ,  In Kwang Bae ,  Jung Min Oh ,  Mi Hyun Park ,  Kun Tack Lee ,  Yong Jun Jun

IPC: B65D85/00 ,  B65D90/46 ,  G01R29/24 ,  C09D5/24 ,  C08L27/20 ,  C08F14/22 ,  C08F14/26 ,  C08K3/04 ,  H01L21/67

CPC classification number: B65D85/70 ,  B05B5/025 ,  B05C11/10 ,  B65D90/46 ,  C08F14/22 ,  C08F14/26 ,  C08G2261/1424 ,  C08G2261/312 ,  C08G2261/3221 ,  C08G2261/3223 ,  C08G2261/3422 ,  C08G2261/51 ,  C08K3/041 ,  C08K3/042 ,  C08L27/20 ,  C08L65/00 ,  C09D5/24 ,  G01R29/24 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67253

Abstract: A chemical liquid supply apparatus includes a storage container configured to accommodate a chemical liquid for processing a semiconductor substrate, a chemical liquid supply pipe, a supply nozzle, and a grounding conductor. A conductive layer including a non-metallic conductive material is formed on an inner surface of the chemical liquid supply pipe. The supply nozzle includes a non-metallic conductive material. The conductive layer or the supply nozzle is electrically connected to the grounding conductor which is grounded to an outside of the pipe.