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公开(公告)号：US10435234B2
公开(公告)日：2019-10-08
申请号：US15814842
申请日：2017-11-16
发明人： Yong Jhin Cho , In Kwang Bae , Jung Min Oh , Mi Hyun Park , Kun Tack Lee , Yong Jun Choi
IPC分类号： B05B5/025 , B05C11/10 , B65D85/00 , B65D90/46 , G01R29/24 , C09D5/24 , C08L27/20 , H01L21/67 , C08F14/26 , C08K3/04 , C08F14/22
摘要： A chemical liquid supply apparatus includes a storage container configured to accommodate a chemical liquid for processing a semiconductor substrate, a chemical liquid supply pipe, a supply nozzle, and a grounding conductor. A conductive layer including a non-metallic conductive material is formed on an inner surface of the chemical liquid supply pipe. The supply nozzle includes a non-metallic conductive material. The conductive layer or the supply nozzle is electrically connected to the grounding conductor which is grounded to an outside of the pipe.
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2.发明申请公开(公告)号：US20180334318A1
公开(公告)日：2018-11-22
申请号：US15814842
申请日：2017-11-16
发明人： Yong Jhin Cho , In Kwang Bae , Jung Min Oh , Mi Hyun Park , Kun Tack Lee , Yong Jun Jun
IPC分类号： B65D85/00 , B65D90/46 , G01R29/24 , C09D5/24 , C08L27/20 , C08F14/22 , C08F14/26 , C08K3/04 , H01L21/67
CPC分类号： B65D85/70 , B05B5/025 , B05C11/10 , B65D90/46 , C08F14/22 , C08F14/26 , C08G2261/1424 , C08G2261/312 , C08G2261/3221 , C08G2261/3223 , C08G2261/3422 , C08G2261/51 , C08K3/041 , C08K3/042 , C08L27/20 , C08L65/00 , C09D5/24 , G01R29/24 , H01L21/67051 , H01L21/6708 , H01L21/67253
摘要： A chemical liquid supply apparatus includes a storage container configured to accommodate a chemical liquid for processing a semiconductor substrate, a chemical liquid supply pipe, a supply nozzle, and a grounding conductor. A conductive layer including a non-metallic conductive material is formed on an inner surface of the chemical liquid supply pipe. The supply nozzle includes a non-metallic conductive material. The conductive layer or the supply nozzle is electrically connected to the grounding conductor which is grounded to an outside of the pipe.
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