公开(公告)号：US12288788B2

公开(公告)日：2025-04-29

申请号：US17410326

申请日：2021-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inyeal Lee ,  Jinwook Kim ,  Dongbeen Kim ,  Deokhan Bae ,  Junghoon Seo ,  Myungyoon Um ,  Jongmil Youn ,  Yonggi Jeong

IPC: H01L27/088 ,  H01L23/50

Abstract: An integrated circuit device includes substrate including a fin-type active area extending on the substrate in a first direction parallel to an upper surface of the substrate, a first gate line crossing the fin-type active area on the substrate and extending in a second direction perpendicular to the first direction, a cut gate line extending in the second direction and being spaced apart from the first gate line with a first gate cut area therebetween, a second gate line extending in the second direction and being spaced apart from the cut gate line with a second gate cut area therebetween, and a power wiring disposed on the cut gate line.

公开(公告)号：US12100899B2

公开(公告)日：2024-09-24

申请号：US17943679

申请日：2022-09-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woojin Park ,  Donguk Choi ,  Junghoon Seo ,  Jongin Lee ,  Hwikyung Choi

IPC: H01Q1/38 ,  H01Q1/22 ,  H01Q9/06 ,  H01Q21/20 ,  H04B7/0413

CPC classification number: H01Q21/205 ,  H01Q1/2291 ,  H01Q9/065 ,  H04B7/0413

Abstract: An electronic device including a plurality of antennas is provided. The electronic device includes a housing, a first antenna disposed in the housing, a second antenna disposed in the housing, and spaced apart from the first antenna, a printed circuit board disposed in the housing and a wireless communication circuit disposed on the PCB, and transmitting or receiving a RF signal of a frequency band through the first antenna and the second antenna, the first antenna includes a first dielectric substrate including a first surface and a second surface facing away from the first surface, a first conductive pattern disposed on the first surface, and operating as an antenna radiator for transmitting or receiving an RF signal of a first frequency band and a second conductive pattern disposed on the second surface, and operating as an antenna radiator for transmitting or receiving an RF signal of the first frequency band.

公开(公告)号：US12288749B2

公开(公告)日：2025-04-29

申请号：US18647307

申请日：2024-04-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inyeal Lee ,  Dongbeen Kim ,  Jinwook Kim ,  Juhun Park ,  Deokhan Bae ,  Junghoon Seo ,  Myungyoon Um

IPC: H01L23/522 ,  H01L23/00 ,  H01L23/535 ,  H01L27/092 ,  H01L29/06 ,  H01L29/417 ,  H01L29/423 ,  H01L29/78 ,  H01L29/786

Abstract: A circuit chip including a substrate, first and second channel active regions on the substrate, and extending in a first direction, the second channel active regions spaced apart from the first channel regions in a second direction intersecting the first direction, first and second gate electrodes intersecting the second channel active regions, third and fourth gate electrodes intersecting the first channel active regions, and a contact electrode between the first, second, third, and fourth gate electrodes. The contact electrode including a stem section in a vertical direction, and first and second branch sections extending from the stem section and contacting a respective source/drain region on the first and second channel active regions, the first gate electrode and the third gate electrode overlapping in the second direction, and including edge portions having widths decreasing as the first gate electrode and the third gate electrode extend toward facing ends thereof.

公开(公告)号：US11996364B2

公开(公告)日：2024-05-28

申请号：US17521080

申请日：2021-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inyeal Lee ,  Dongbeen Kim ,  Jinwook Kim ,  Juhun Park ,  Deokhan Bae ,  Junghoon Seo ,  Myungyoon Um

IPC: H01L23/535 ,  H01L23/00 ,  H01L23/522 ,  H01L27/092 ,  H01L29/06 ,  H01L29/417 ,  H01L29/423 ,  H01L29/78 ,  H01L29/786

CPC classification number: H01L23/535 ,  H01L23/5226 ,  H01L24/13 ,  H01L27/0924 ,  H01L29/0665 ,  H01L29/41733 ,  H01L29/41791 ,  H01L29/42392 ,  H01L29/78391 ,  H01L29/7851 ,  H01L29/78696 ,  H01L2224/13025

Abstract: A circuit chip including a substrate, first and second channel active regions on the substrate, and extending in a first direction, the second channel active regions spaced apart from the first channel regions in a second direction intersecting the first direction, first and second gate electrodes intersecting the second channel active regions, third and fourth gate electrodes intersecting the first channel active regions, and a contact electrode between the first, second, third, and fourth gate electrodes. The contact electrode including a stem section in a vertical direction, and first and second branch sections extending from the stem section and contacting a respective source/drain region on the first and second channel active regions, the first gate electrode and the third gate electrode overlapping in the second direction, and including edge portions having widths decreasing as the first gate electrode and the third gate electrode extend toward facing ends thereof.