SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

    公开(公告)号:US20180261460A1

    公开(公告)日:2018-09-13

    申请号:US15825135

    申请日:2017-11-29

    Abstract: Semiconductor devices and methods for fabricating the same are provided. A semiconductor device may include a substrate including first and second regions, a first interface film disposed on the substrate in the first region, a second interface film disposed on the substrate in the second region, a dielectric film disposed on the first and second interface films, a first metal film disposed on the dielectric film in the first region, and a second metal film disposed on the dielectric film in the second region. The first and second interface films may comprise an oxide of the substrate, the first and second metal films may comprise different materials, and the first and second interface films may have different thicknesses. Channels may be provided in the first and second regions, and the channels may be fin-shaped or wire-shaped. The metal films may have different oxygen content.

    IMAGE DEVICE AND FABRICATING METHOD THEREOF

    公开(公告)号:US20210175266A1

    公开(公告)日:2021-06-10

    申请号:US16926897

    申请日:2020-07-13

    Abstract: An image device includes a first active region and a second active region disposed on a substrate. Each of the first active region and the second active region includes a gate insulating layer disposed on the substrate and a gate electrode disposed on the gate insulating layer. At least one of the first active region and the second active region further includes a first passivation layer containing fluorine (F) disposed between the gate insulating layer and the gate electrode. A concentration of fluorine in the gate insulating layer is higher than a concentration of fluorine in the gate electrode.

Patent Agency Ranking