公开(公告)号：US20170084986A1

公开(公告)日：2017-03-23

申请号：US15255568

申请日：2016-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gi-Uk GANG ,  Byeonghwan YOUM ,  Kyung Bin KIM

IPC: H01Q1/24 ,  H01Q1/38 ,  H05K5/02

CPC classification number: H01Q1/243 ,  H01Q5/371 ,  H01Q9/42

Abstract: Disclosed is an electronic device having a housing and including an antenna device, and a method of manufacturing the housing. When the antenna device requiring a plating process is applied to the housing, the housing has an antenna and provides exterior deposition and visual enhancement to the electronic device.

公开(公告)号：US20150288055A1

公开(公告)日：2015-10-08

申请号：US14677217

申请日：2015-04-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byeong Hwan YOUM ,  Jong Kwon KO ,  Hyung Jin KIM ,  Seung Hwan KIM ,  Kyung Bin KIM ,  Austin KIM ,  Joon Ho BYUN ,  Yu Ri SIN

IPC: H01Q1/24

CPC classification number: H01Q1/243 ,  B29C45/14836 ,  B29C2045/0049 ,  B29K2995/0005 ,  B29L2031/3456 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q5/371 ,  H01Q9/42

Abstract: An antenna module and an electronic device are provided. The antenna module may include a first case including a case surface, wherein at least one antenna protection part is disposed on the first case, and wherein the at least one antenna projection part is formed to be distinguishable from the case surface, an antenna including a pattern, wherein at least a part of the pattern of the antenna is adjacently disposed to the antenna protection part.

Abstract translation: 提供天线模块和电子设备。 天线模块可以包括包括壳体表面的第一壳体，其中至少一个天线保护部件设置在第一壳体上，并且其中所述至少一个天线突出部分形成为可以与壳体表面区分开，天线包括 图案，其中天线的图案的至少一部分相邻地设置在天线保护部分上。

公开(公告)号：US20170133748A1

公开(公告)日：2017-05-11

申请号：US15256926

申请日：2016-09-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung Bin KIM ,  Jinu KIM ,  Byeonghwan YOUM ,  Gi-Uk GANG ,  Nak-Chung CHOI

IPC: H01Q1/24 ,  H05K5/00 ,  H05K5/03

CPC classification number: H01Q1/243 ,  H01Q9/42 ,  H01Q21/28 ,  H05K5/0217 ,  H05K5/0247

Abstract: Various embodiments of the present disclosure may provide an electronic device that includes: a first cover configured to form a first surface of the electronic device; a second cover configured to form a second surface of the electronic device, the second cover being opposite to the first surface; a conductive sidewall configured to surround at least a part of a space formed between the first cover and the second cover; a conductive member located in the space and configured to integrally extend from the conductive sidewall, the conductive member including a first surface directed toward the first cover and a second surface directed toward the second cover; a non-conductive member located in the space to make contact with the conductive member, the non-conductive member including a first surface directed toward the first cover and a second surface directed toward the second cover; a conductive pattern disposed on the second surface of the non-conductive member and electrically connected to the conductive member; and a conductive structure disposed between the conductive pattern and the conductive member to electrically connect the conductive pattern to the conductive member. The non-conductive member may include a via hole that at least partially passes through the area between the first surface and the second surface thereof, and the conductive structure may include a first part having a first cross-sectional area and a second part having a second cross-sectional area that is larger than the first cross-sectional area, wherein at least a part of the conductive structure may be disposed within a through-hole of the non-conductive member, and the second part may be disposed closer to the second surface of the non-conductive member than the first part. Various other embodiments are possible.