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    ANALOG-TO-DIGITAL CONVERTER
    4.
    发明申请
    ANALOG-TO-DIGITAL CONVERTER 有权

    公开(公告)号：US20250096811A1

    公开(公告)日：2025-03-20

    申请号：US18627940

    申请日：2024-04-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyung Dong ROH ,  Kyung Hoon LEE ,  Woong Taek LIM ,  Young Jae CHO ,  Michael CHOI

    IPC: H03M1/12

    Abstract: An analog-to-digital converter is provided. An analog-to-digital converter comprises an interleaver receiving and processing an input signal that is an analog signal and a plurality of sub-ADCs, wherein the interleaver includes a reference circuit outputting a second voltage based on a first voltage, a high-pass filter receiving the second voltage and outputting a first signal obtained by changing a common mode voltage of the input signal to the second voltage, a sampling circuit generating a second signal obtained by sampling an alternate current component of the first signal, and a buffer outputting a third signal obtained by buffering the second signal by using a buffering circuit, and the sub-ADC converts the third signal into a digital signal by using the first voltage.

    INSPECTION SYSTEM AND METHODS OF FABRICATING AND INSPECTING SEMICONDUCTOR DEVICE USING THE SAME
    5.
    发明申请
    INSPECTION SYSTEM AND METHODS OF FABRICATING AND INSPECTING SEMICONDUCTOR DEVICE USING THE SAME 审中-公开
    使用该方法制造和检查半导体器件的检查系统和方法

    公开(公告)号：US20150355108A1

    公开(公告)日：2015-12-10

    申请号：US14686913

    申请日：2015-04-15

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jang Ik PARK ,  Bong Seok KIM ,  Jung Hoon BYUN ,  Kyung Hoon LEE ,  Woo-Young CHOI

    IPC: G01N21/956 ,  G01N21/21 ,  G01N21/88

    CPC classification number: G01N21/95607 ,  G01N21/211 ,  G01N2021/213 ,  H01L22/12

    Abstract: A method of inspecting a semiconductor device includes measuring an inspection pattern formed on a semiconductor substrate using a measurer configured to measure optical signals reflected from the inspection pattern to obtain a signal expressed by a matrix including spectrum data associated with the inspection pattern, obtaining a first element including a first spectrum from the signal and obtaining a second element including a second spectrum from the signal, obtaining a skew spectrum using a difference between the first and second spectrums, and obtaining an asymmetric signal associated with the inspection pattern using the skew spectrum, the obtaining of the asymmetric signal including obtaining a polarity of the skew spectrum in a wavelength range, and obtaining a numerical value associated with an area of the skew spectrum.

    Abstract translation: 检查半导体器件的方法包括使用测量器测量在半导体衬底上形成的检查图案，所述测量器被配置为测量从检查图案反射的光信号，以获得由包括与检查图案相关联的光谱数据的矩阵表示的信号，获得第一 元件，其包括来自信号的第一频谱，并从信号中获得包括第二频谱的第二元素，使用第一和第二频谱之间的差获得偏斜谱，并使用偏斜谱获得与检查图谱相关联的非对称信号， 获得非对称信号，包括获得在波长范围内的偏斜谱的极性，以及获得与偏斜谱的区域相关联的数值。

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