公开(公告)号：US10058952B2

公开(公告)日：2018-08-28

申请号：US15340303

申请日：2016-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung-Dae Seok ,  Sang Yoon Kim ,  Hui Jae Kim ,  Jae Bong Shin ,  Byung Joon Lee

IPC: B23K37/00 ,  B23K20/02 ,  H01L23/00 ,  B23K20/00 ,  B23K20/26 ,  B23K3/08

CPC classification number: B23K20/026 ,  B23K3/085 ,  B23K20/004 ,  B23K20/26 ,  B23K37/003 ,  H01L24/75 ,  H01L2224/75251 ,  H01L2224/75501 ,  H01L2224/7598 ,  H01L2224/75988

Abstract: A bonding stage is provided. The bonding stage includes a first heater disposed under a first region of a substrate having a plurality of semiconductor chips disposed thereon, a second heater disposed under a second region different from the first region of the substrate, a cooler disposed under the first heater and the second heater and blocking heat of the first heater and heat of the second heater from being transferred to lower portions of the first heater and the second heater, and a thin plate disposed on the first heater and the second heater to support the substrate and transferring the heat of the first heater and the heat of the second heater to the substrate, wherein the first heater and the second heater are independently operated.

公开(公告)号：US11023078B2

公开(公告)日：2021-06-01

申请号：US16324486

申请日：2017-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shin A Kim ,  Ho June Yoo ,  Sang Yoon Kim ,  Eun Seo Kim ,  Nam Su Ha

IPC: G06F3/042 ,  G06F3/041 ,  G06F3/03 ,  H03K17/96 ,  H03K17/945 ,  H03K17/94

Abstract: A control method of an inputter comprises an operation in which at least one of the inputter and an electronic apparatus connected to the inputter acquires reference data, an operation in which a manipulation detector of the inputter outputs a manipulation detection signal, an operation in which a light source of the inputter irradiates a first light, an operation in which a light detector detects a first reflected light that is incident to the light detector among the irradiated first light, and an operation in which at least one of the inputter and the electronic apparatus compares a detection result of the first reflected light and the reference data, and identifies whether the manipulation detector outputting the manipulation signal malfunctions, based on a comparison result.

公开(公告)号：US20170136570A1

公开(公告)日：2017-05-18

申请号：US15340303

申请日：2016-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Dae Seok ,  Sang Yoon Kim ,  Hui Jae KIM ,  Jae Bong SHIN ,  Byung Joon LEE

IPC: B23K20/02 ,  B23K20/00 ,  B23K20/26 ,  H01L23/00

CPC classification number: B23K20/026 ,  B23K3/085 ,  B23K20/004 ,  B23K20/26 ,  B23K37/003 ,  H01L24/75 ,  H01L2224/75251 ,  H01L2224/75501 ,  H01L2224/7598 ,  H01L2224/75988

Abstract: A bonding stage is provided. The bonding stage includes a first heater disposed under a first region of a substrate having a plurality of semiconductor chips disposed thereon, a second heater disposed under a second region different from the first region of the substrate, a cooler disposed under the first heater and the second heater and blocking heat of the first heater and heat of the second heater from being transferred to lower portions of the first heater and the second heater, and a thin plate disposed on the first heater and the second heater to support the substrate and transferring the heat of the first heater and the heat of the second heater to the substrate, wherein the first heater and the second heater are independently operated.