公开(公告)号：US20140015118A1

公开(公告)日：2014-01-16

申请号：US13834091

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong-kon BAE ,  Jae-hyuck WOO ,  Won-sik KANG ,  Sung-ki KIM ,  Yang-hyo KIM

IPC: H01L23/367

CPC classification number: H01L23/3675 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/10158 ,  H01L2924/00

Abstract: A semiconductor chip includes a semiconductor substrate including a first surface and a second surface, an integrated circuit (IC) on the first surface of the semiconductor substrate, and a heat radiation portion on the second surface of the semiconductor substrate. The heat radiation portion includes heat radiation patterns in a direction perpendicular to the second surface, and a heat radiation layer on upper portions of the heat radiation patterns. The heat radiation patterns include a plurality of recesses and a plurality of protrusions and the heat radiation layer includes a metal material and has a flat upper surface.

Abstract translation: 半导体芯片包括具有第一表面和第二表面的半导体衬底，在半导体衬底的第一表面上的集成电路（IC）和半导体衬底的第二表面上的散热部分。 热辐射部分包括在垂直于第二表面的方向上的散热图案，以及在散热图案的上部上的散热层。 散热图案包括多个凹部和多个突起，并且散热层包括金属材料并具有平坦的上表面。

公开(公告)号：US20170042493A1

公开(公告)日：2017-02-16

申请号：US15175223

申请日：2016-06-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Alexander YUN ,  Sung-ki KIM ,  Il SEONG

IPC: A61B6/00 ,  A61B6/03

CPC classification number: A61B6/4488 ,  A61B6/035 ,  A61B2560/0406 ,  H01J2235/12 ,  H01J2235/1208 ,  H01J2235/1216 ,  H01J2235/1225 ,  H01J2235/127 ,  H01J2237/002 ,  H05G1/025

Abstract: Provided is a CT system having a cooling system. The CT system may include a gantry unit including: a rotor; and an assembly component; an intake provided on a first surface of the rotor; and an outtake provided on a second surface opposite to the first surface of the rotor, wherein the gantry unit is cooled by air moving through the intake and the outtake due to a rotation force or a centrifugal force generated by a rotation movement of the rotor.

Abstract translation: 提供具有冷却系统的CT系统。 CT系统可以包括龙门架单元，其包括：转子; 和组装组件; 设置在转子的第一表面上的进气口; 并且设置在与转子的第一表面相对的第二表面上的输出，其中通过由转子的旋转运动产生的旋转力或离心力，通过进气和空气移动的空气来冷却台架单元。

公开(公告)号：US20160235378A1

公开(公告)日：2016-08-18

申请号：US15002772

申请日：2016-01-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Alexander YUN ,  Sung-ki KIM ,  Jeong-min NA ,  Il SEONG ,  Chang-yeon WON ,  Tae-sik CHO

IPC: A61B6/00 ,  A61B6/04 ,  A61B6/03

Abstract: A cooling system of a computed tomography (CT) system provides for a more efficient operation than known heretofore. The cooling system of the CT system includes a gantry and a table that moves an object into a bore of the gantry. The gantry includes part boxes mounted therein, and blade elements are formed in regions of the part boxes. The cooling system of the CT system includes a cooling method that includes a multiple cooling method including a stand-by mode and an operating mode.

Abstract translation: 计算机断层摄影（CT）系统的冷却系统提供比迄今为止更有效的操作。 CT系统的冷却系统包括台架和将物体移动到台架的孔中的台子。 台架包括安装在其中的部件盒，并且刀片元件形成在部件盒的区域中。 CT系统的冷却系统包括包括备用模式和运行模式的多重冷却方法的冷却方法。

公开(公告)号：US20140014975A1

公开(公告)日：2014-01-16

申请号：US13837757

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong-kon BAE ,  Won-sik KANG ,  Jae-hyuck WOO ,  Sung-ki KIM ,  Yang-hyo KIM ,  Do-kyung KIM

IPC: H01L23/367 ,  H01L33/64

CPC classification number: H01L23/3677 ,  H01L23/367 ,  H01L23/5226 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor chip includes a circuit region having an integrated semiconductor circuit on a semiconductor substrate, and a heat radiation member on at least a portion of a scribe lane region configured to at least partially surround the circuit region, the heat radiation member including a plurality of heat radiation fins that extend in a direction orthogonal to an upper surface of the semiconductor substrate.

Abstract translation: 半导体芯片包括在半导体衬底上具有集成半导体电路的电路区域，以及至少部分地构成为至少部分地围绕电路区域的划线通道区域的至少一部分上的散热构件，该散热构件包括多个 散热翅片，其在与半导体基板的上表面正交的方向上延伸。