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公开(公告)号：US20240365486A1
公开(公告)日：2024-10-31
申请号：US18648061
申请日：2024-04-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yeonwoo KIM , Yongbeen YUN , Taekkyun CHOI , Hyunsoo KIM , Chonghwa SEO
IPC: H05K5/02
CPC classification number: H05K5/0217 , H05K5/0247
Abstract: An electronic device includes a display including a panel conductive layer, a mechanical support part facing the display, and a conductive member disposed between the panel conductive layer and the mechanical support part where the conductive member includes an elastic member at least partially accommodated in the mechanical support part and a conductive plate electrically connected with the panel conductive layer, the conductive plate including a base region surrounding at least a portion of the elastic member and a wing region, the elastic member includes a front surface facing in a first direction toward the panel conductive layer and disposed in a higher position than the wing region, a side surface facing in a second direction perpendicular to the first direction, and a rear surface facing in a direction opposite to the first direction and disposed in a lower position than the wing region extending in the second direction.
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公开(公告)号：US20230083408A1
公开(公告)日：2023-03-16
申请号：US17990778
申请日：2022-11-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Soon PARK , Yeonwoo KIM , Haekwon LEE , Woosup LEE , Hyoseok NA
Abstract: Disclosed is an antenna module including a first printed circuit board (PCB) including a first surface facing a first direction and a second surface facing a second direction opposite the first direction, a second PCB including a third surface facing the first direction spaced from the first PCB and a fourth surface facing the second direction spaced from the first surface, a radio frequency integrated circuit (RFIC) disposed on the first surface, and a connection member comprising a conductive material connecting the first surface to the fourth surface. The at least one first conductive pattern is connected to the RFIC. The at least one third conductive pattern is connected to the RFIC via the connection member. The at least one first conductive pattern and the at least one third conductive pattern at least partially overlap with each other at least partly, when viewed from above the second surface.
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公开(公告)号：US20160226132A1
公开(公告)日：2016-08-04
申请号：US15013496
申请日：2016-02-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yeonwoo KIM , Seunggil JEON , Jung-Sik PARK
Abstract: An antenna of an electronic device is provided. The antenna includes a substrate including a ground portion, an external metallic frame of the electronic device, a float ground portion arranged to be connected to the external metallic frame in a state of being disconnected from the substrate, and at least one radiator electrically connected to the float ground portion. Upon being fed with power, the at least one radiator may operate as an antenna radiator, or a section of the external metallic frame may operate as the antenna radiator.
Abstract translation: 提供电子设备的天线。 所述天线包括基板，所述基板包括接地部分，所述电子设备的外部金属框架，布置成以与所述基板断开的状态连接到所述外部金属框架的浮动接地部分，以及至少一个散热器，电连接到 浮地面部分。 在馈电时，至少一个辐射器可以作为天线辐射器工作，或者外部金属框架的一部分可以作为天线辐射器工作。
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公开(公告)号：US20210320414A1
公开(公告)日：2021-10-14
申请号：US17265672
申请日：2019-08-27
Inventor： Yeonwoo KIM , Wonbin HONG , Wonpyo KWON , Sehyun PARK , Sumin YUN
Abstract: According to an embodiment disclosed in this specification, an electronic device may include housing and an antenna module disposed on one surface of the housing. The antenna module may include a printed circuit board, a first antenna array disposed one surface of the printed circuit board, a second antenna array disposed on another surface of the printed circuit board and at least partially overlapping with the first antenna array when viewed from one surface of the housing, and a radio frequency integrated circuit (RFIC) electrically connected to the first antenna array and the second antenna array and configured to feed the first antenna array and the second antenna array.
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公开(公告)号：US20210021024A1
公开(公告)日：2021-01-21
申请号：US16911856
申请日：2020-06-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Soon PARK , Yeonwoo KIM , Haekwon LEE , Woosup LEE , Hyoseok NA
Abstract: Disclosed is an antenna module including a first printed circuit board (PCB) including a first surface facing a first direction and a second surface facing a second direction opposite the first direction, a second PCB including a third surface facing the first direction spaced from the first PCB and a fourth surface facing the second direction spaced from the first surface, a radio frequency integrated circuit (RFIC) disposed on the first surface, and a connection member comprising a conductive material connecting the first surface to the fourth surface. The at least one first conductive pattern is connected to the RFIC. The at least one third conductive pattern is connected to the RFIC via the connection member. The at least one first conductive pattern and the at least one third conductive pattern at least partially overlap with each other at least partly, when viewed from above the second surface.
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Patent Agency Ranking
公开(公告)号：US20210066788A1
公开(公告)日：2021-03-04
申请号：US16932945
申请日：2020-07-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yeonwoo KIM
Abstract: Disclosed in one embodiment is an antenna module which includes a printed circuit board (PCB) that includes a first surface, a second surface, and a third surface, a first antenna that is disposed on the first surface, a second antenna that includes a first portion disposed on the second surface, a second portion extended from the first portion so as to be adjacent to the third surface, and a third portion extended from the second portion so as to face the first antenna, at least one ground layer that is interposed between the first antenna and the second antenna, and at least one wire that feeds the first antenna and the second antenna. The first antenna and at least a portion of the first portion overlap each other when viewed in the second direction, and the first antenna and the second portion are disposed to be spaced from each other.
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公开(公告)号：US20180108977A1
公开(公告)日：2018-04-19
申请号：US15846544
申请日：2017-12-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Woosup LEE , Yeonwoo KIM , Jungsik PARK , Seunggil JEON , Juseok NOH , Jaebong CHUN , Hyunju HONG
CPC classification number: H01Q1/243 , H01Q1/40 , H01Q1/42 , H01Q9/26 , H01Q9/42 , H01Q21/28 , H01Q21/29
Abstract: An electronic device having a housing formed of a conductive material, and an antenna device thereof. The electronic device includes a housing provided with a plurality of housing modules, and a printed circuit board positioned inside the housing, and having an antenna power feeding unit electrically connected to the printed circuited board. The plurality of housing modules may be at least partially formed of a conductive material. At least one of the conductive materials of the plurality of housing modules may be electrically connected to the antenna power feeding unit of the printed circuit board so as to function as an antenna of the electronic device. Various embodiments may be made based on the technical idea of the present disclosure.
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公开(公告)号：US20160104930A1
公开(公告)日：2016-04-14
申请号：US14873595
申请日：2015-10-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Woosup LEE , Yeonwoo KIM , Jungsik PARK , Seunggil JEON , Juseok NOH , Jaebong CHUN , Hyunju HONG
IPC: H01Q1/24
CPC classification number: H01Q1/243 , H01Q1/40 , H01Q1/42 , H01Q9/26 , H01Q9/42 , H01Q21/28 , H01Q21/29
Abstract: An electronic device having a housing formed of a condutive material, and an antenna device thereof. The electronic device includes a housing provided with a plurality of housing modules, and a printed circuit board positioned inside the housing, and having an antenna power feeding unit electrically connected to the printed circuited board. The plurality of housing modules may be at least partially formed of a conductive material. At least one of the conductive materials of the plurality of housing modules may be electrically connected to the antenna power feeding unit of the printed circuit board so as to function as an antenna of the electronic device. Various embodiments may be made based on the technical idea of the present disclosure.
Abstract translation: 一种具有由混合材料形成的壳体的电子设备及其天线装置。 电子设备包括设置有多个壳体模块的壳体和位于壳体内部的印刷电路板，并且具有电连接到印刷电路板的天线馈电单元。 多个外壳模块可以至少部分地由导电材料形成。 多个壳体模块中的导电材料中的至少一个可以电连接到印刷电路板的天线馈电单元，以起到电子设备的天线的作用。 可以基于本公开的技术思想进行各种实施例。
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公开(公告)号：US20250142033A1
公开(公告)日：2025-05-01
申请号：US18899575
申请日：2024-09-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Donguk KIM , Sehyun KIM , Yeonwoo KIM , Jongin LEE , Donghwa JEONG
Abstract: An electronic device including an image display portion through which to display content; and at least one processor configured to set a calibration threshold value based on a usage environment of the electronic device, calculate an amount of an external impact applied to the electronic device, compare the calculated amount of the external impact and a magnitude of the set calibration threshold value, and perform a calibration of the image display portion based on the calculated amount of the external impact being greater than the set calibration threshold value.
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公开(公告)号：US20220069441A1
公开(公告)日：2022-03-03
申请号：US17418588
申请日：2019-12-31
Inventor： Yeonwoo KIM , Wonbin HONG , Wonpyo KWON , Sehyun PARK , Sumin YUN
Abstract: An electronic device is disclosed. The electronic device comprises: a first plate including a first planar region facing a first direction; a second plate comprising a second planar region facing a second direction opposite to the first direction; a housing including a side member surrounding an inner space between the first plate and the second plate; a display disposed between the first plate and the second plate and viewed through the first plate; and an antenna module disposed between the display and the second plate and configured to emit electromagnetic waves to the outside of the housing. The antenna module comprises: an antenna substrate including a first surface facing the first plate, a second surface facing the second plate, and a third surface facing the inner surface of the side member; and a wireless communication circuit disposed on the first surface of the antenna substrate. The antenna substrate comprises: a first antenna adjacent to the first surface or formed on the first surface; a second antenna adjacent to the second surface or formed on the second surface; and a third antenna formed between the first antenna and the second antenna. The first antenna is formed at a first distance from the third surface, the second antenna is formed at a second distance from the third surface, and the third antenna may be formed at a third distance that is greater than the first distance and the second distance from the third surface. Various other embodiments inferred from the present specification are also possible.
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