公开(公告)号：US11492251B2

公开(公告)日：2022-11-08

申请号：US17288267

申请日：2019-11-04

Applicant: Sciosense B.V.

Inventor： Kailash Vijayakumar ,  Remco Henricus Wilhelmus Pijnenburg ,  Willem Frederik Adrianus Besling ,  Sophie Guillemin ,  Jörg Siegert

IPC: B81C1/00

Abstract: In an embodiment, a method for manufacturing a micro-electro-mechanical systems (MEMS) transducer device includes providing a substrate body with a surface, depositing an etch-stop layer (ESL) on the surface, depositing a sacrificial layer on the ESL, depositing a diaphragm layer on the sacrificial layer and removing the sacrificial layer, wherein depositing the sacrificial layer includes depositing a first sub-layer of a first material and depositing a second sub-layer of a second material, and wherein the first material and the second material are different materials.

公开(公告)号：US11878906B2

公开(公告)日：2024-01-23

申请号：US17937123

申请日：2022-09-30

Applicant: Sciosense B.V.

Inventor： Kailash Vijayakumar ,  Remco Henricus Wilhelmus Pijnenburg ,  Willem Frederik Adrianus Besling ,  Sophie Guillemin ,  Jörg Siegert

IPC: B81C1/00

CPC classification number: B81C1/00476 ,  B81C1/00595 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C2201/014 ,  B81C2201/0132 ,  B81C2201/053

Abstract: In an embodiment, an integrated MEMS transducer device includes a substrate body having a first electrode on a substrate, an etch stop layer located on a surface of the substrate, a suspended micro-electro-mechanical systems (MEMS) diaphragm with a second electrode, an anchor structure with anchors connecting the MEMS diaphragm to the substrate body and a sacrificial layer in between the anchors of the anchor structure, the sacrificial layer including a first sub-layer of a first material, wherein the first sub-layer is arranged on the etch stop layer, a second sub-layer of a second material, wherein the second sub-layer is arranged on the first sub-layer, and wherein the first and the second material are different materials.

公开(公告)号：US20200340875A1

公开(公告)日：2020-10-29

申请号：US16958269

申请日：2019-01-10

Applicant: Sciosense B.V.

Inventor： Willem Frederik Adrianus Besling ,  Remco Henricus Wilhelmus Pijnenburg ,  Kailash Vijayakumar ,  Jörg Siegert ,  Alessandro Faes

IPC: G01L9/00

Abstract: A capacitive sensor is disclosed. In an embodiment a semiconductor device includes a die including a capacitive pressure sensor integrated on a CMOS circuit, wherein the capacitive pressure sensor includes a first electrode and a second electrode separated from one another by a cavity, the second electrode including a suspended tensile membrane, and wherein the first electrode is composed of one or more aluminum-free layers containing Ti.

公开(公告)号：US11585711B2

公开(公告)日：2023-02-21

申请号：US16958269

申请日：2019-01-10

Applicant: Sciosense B.V.

Inventor： Willem Frederik Adrianus Besling ,  Remco Henricus Wilhelmus Pijnenburg ,  Kailash Vijayakumar ,  Jörg Siegert ,  Alessandro Faes

IPC: G01L9/00

Abstract: A capacitive sensor is disclosed. In an embodiment a semiconductor device includes a die including a capacitive pressure sensor integrated on a CMOS circuit, wherein the capacitive pressure sensor includes a first electrode and a second electrode separated from one another by a cavity, the second electrode including a suspended tensile membrane, and wherein the first electrode is composed of one or more aluminum-free layers containing Ti.

公开(公告)号：US20230036935A1

公开(公告)日：2023-02-02

申请号：US17937123

申请日：2022-09-30

Applicant: Sciosense B.V.

Inventor： Kailash Vijayakumar ,  Remco Henricus Wilhelmus Pijnenburg ,  Willem Frederik Adrianus Besling ,  Sophie Guillemin ,  Jörg Siegert

IPC: B81C1/00

Abstract: In an embodiment, an integrated MEMS transducer device includes a substrate body having a first electrode on a substrate, an etch stop layer located on a surface of the substrate, a suspended micro-electro-mechanical systems (MEMS) diaphragm with a second electrode, an anchor structure with anchors connecting the MEMS diaphragm to the substrate body and a sacrificial layer in between the anchors of the anchor structure, the sacrificial layer including a first sub-layer of a first material, wherein the first sub-layer is arranged on the etch stop layer, a second sub-layer of a second material, wherein the second sub-layer is arranged on the first sub-layer, and wherein the first and the second material are different materials.

公开(公告)号：US11293821B2

公开(公告)日：2022-04-05

申请号：US16316079

申请日：2017-07-19

Applicant: Sciosense B.V.

Inventor： Roel Daamen ,  Kailash Vijayakumar ,  Hendrik Bouman ,  Remco Henricus Wilhelmus Pijnenburg ,  Twan Van Lippen

IPC: G01L9/00 ,  B81C1/00

Abstract: In an embodiment, a pressure sensor module includes a base electrode surrounding at least a part of a bottom electrode, an anchor arrangement on top of the base electrode including at least two electrically conductive walls that both surround at least the part of the bottom electrode and an electrically conductive layer that covers at least the bottom electrode and the anchor arrangement such that a cavity is formed between the bottom electrode, the anchor arrangement and the electrically conductive layer, wherein, on at least one side of the cavity, a proportionate area of the electrically conductive walls in a cross section extending from a surface of an inner wall of the anchor arrangement facing the cavity to a surface of an outermost wall of the anchor arrangement facing away from the cavity in a plane parallel to a plane of the bottom electrode is equal to or less than 10%.

公开(公告)号：US20210387854A1

公开(公告)日：2021-12-16

申请号：US17288267

申请日：2019-11-04

Applicant: Sciosense B.V.

Inventor： Kailash Vijayakumar ,  Remco Henricus Wilhelmus Pijnenburg ,  Willem Frederik Adrianus Besling ,  Sophie Guillemin ,  Jörg Siegert

IPC: B81C1/00

Abstract: In an embodiment, a method for manufacturing a micro-electro-mechanical systems (MEMS) transducer device includes providing a substrate body with a surface, depositing an etch-stop layer (ESL) on the surface, depositing a sacrificial layer on the ESL, depositing a diaphragm layer on the sacrificial layer and removing the sacrificial layer, wherein depositing the sacrificial layer includes depositing a first sub-layer of a first material and depositing a second sub-layer of a second material, and wherein the first material and the second material are different materials.