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公开(公告)号：US08246900B2
公开(公告)日：2012-08-21
申请号：US12440034
申请日：2007-08-31
申请人： Shigeru Kasai , Hiroyuki Miyashita , Masatake Yoneda , Tomohiro Suzuki , Sumi Tanaka , Masamichi Nomura , Miwa Shimizu
发明人： Shigeru Kasai , Hiroyuki Miyashita , Masatake Yoneda , Tomohiro Suzuki , Sumi Tanaka , Masamichi Nomura , Miwa Shimizu
CPC分类号： H01L21/67115 , H01L21/67109 , H01L31/1864 , Y02E10/50 , Y02P70/521
摘要： Provided is an annealing apparatus, which is free from a problem of reduced light energy efficiency resulted by the reduction of light emission amount due to a heat generation and capable of maintaining stable performance. The apparatus includes: a processing chamber 1 for accommodating a wafer W; heating sources 17a and 17b including LEDs 33 and facing the surface of the wafer W to irradiate light on the wafer W; light-transmitting members 18a and 18b arranged in alignment with the heating sources 17a and 17b to transmit the light emitted from the LEDs 33; cooling members 4a and 4b supporting the light-transmitting members 18a and 18b at opposite side to the processing chamber 1 to make direct contact with the heating sources 17a and 17b and made of a material of high thermal conductivity; and a cooling mechanism for cooling the cooling members 4a and 4b with a coolant.
摘要翻译： 提供一种退火装置，其不会由于发热而导致的发光量的降低而导致光能效率降低的问题，并且能够保持稳定的性能。 该装置包括：用于容纳晶片W的处理室1; 加热源17a和17b包括LED33并面向晶片W的表面以将光照射在晶片W上; 与发热源17a和17b对准布置的透光部件18a和18b，以透射从LED33发出的光; 在与处理室1相反的一侧支撑透光部件18a和18b的冷却部件4a和4b与加热源17a和17b直接接触并由导热性高的材料制成; 以及用冷却剂冷却冷却部件4a，4b的冷却机构。
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公开(公告)号：US20100038833A1
公开(公告)日：2010-02-18
申请号：US12440034
申请日：2007-08-31
申请人： Shigeru Kasai , Hiroyuki Miyashita , Masatake Yoneda , Tomohiro Suzuki , Sumi Tanaka , Masamichi Nomura , Miwa Shimizu
发明人： Shigeru Kasai , Hiroyuki Miyashita , Masatake Yoneda , Tomohiro Suzuki , Sumi Tanaka , Masamichi Nomura , Miwa Shimizu
CPC分类号： H01L21/67115 , H01L21/67109 , H01L31/1864 , Y02E10/50 , Y02P70/521
摘要： Provided is an annealing apparatus, which is free from a problem of reduced light energy efficiency resulted by the reduction of light emission amount due to a heat generation and capable of maintaining stable performance. The apparatus includes: a processing chamber 1 for accommodating a wafer W; heating sources 17a and 17b including LEDs 33 and facing the surface of the wafer W to irradiate light on the wafer W; light-transmitting members 18a and 18b arranged in alignment with the heating sources 17a and 17b to transmit the light emitted from the LEDs 33; cooling members 4a and 4b supporting the light-transmitting members 18a and 18b at opposite side to the processing chamber 1 to make direct contact with the heating sources 17a and 17b and made of a material of high thermal conductivity; and a cooling mechanism for cooling the cooling members 4a and 4b with a coolant.
摘要翻译： 提供一种退火装置，其不会由于发热而导致的发光量的降低而导致光能效率降低的问题，并且能够保持稳定的性能。 该装置包括：用于容纳晶片W的处理室1; 加热源17a和17b包括LED33并面向晶片W的表面以将光照射在晶片W上; 与发热源17a和17b对准布置的透光部件18a和18b，以透射从LED33发出的光; 在与处理室1相反的一侧支撑透光部件18a和18b的冷却部件4a和4b与加热源17a和17b直接接触并由导热性高的材料制成; 以及用冷却剂冷却冷却部件4a，4b的冷却机构。
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公开(公告)号：US20120118504A1
公开(公告)日：2012-05-17
申请号：US13386572
申请日：2010-07-21
申请人： Masamichi Nomura , Kenjiro Koizumi , Shigeru Kasai , Sumi Tanaka
发明人： Masamichi Nomura , Kenjiro Koizumi , Shigeru Kasai , Sumi Tanaka
IPC分类号： B44C1/22 , C23C16/458 , C23C16/52 , B25B11/00 , B24C3/00
CPC分类号： H01L21/68792
摘要： A processing apparatus for performing a process on an object includes a chamber; a rotary floater for supporting the object on its upper end side; XY rotating attraction bodies provided in the rotary floater at an interval circumferentially; a floating attraction body provided in the rotary floater to extend circumferentially; a floating electromagnet group for floating the rotary floater while adjusting an inclination of the rotary floater by applying a vertically upward acting magnetic attraction to the floating attraction body; an XY rotating electromagnet group for rotating the rotary floater while adjusting a horizontal position of the rotary floater by applying a magnetic attraction force to the XY rotating attraction bodies; a gas supply for supplying a gas into the chamber; a mechanism for performing a process on the object; and an apparatus control unit for controlling an entire operation of the apparatus.
摘要翻译： 用于对物体进行处理的处理装置包括：室; 用于在其上端侧支撑物体的旋转浮子; XY旋转吸引体以周向间隔设置在旋转浮子中; 浮动吸引体，设置在所述旋转浮子中以沿周向延伸; 浮动电磁体组，用于通过向浮动吸引体施加垂直向上作用的磁吸引力来调节旋转浮子的倾斜度而浮动旋转浮子; XY旋转电磁体组，用于通过向XY旋转吸引体施加磁力来调节旋转浮子的水平位置来旋转旋转浮筒; 用于将气体供应到所述室中的气体供应源; 用于对物体执行处理的机构; 以及用于控制装置的整个操作的装置控制单元。
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公开(公告)号：US20100164315A1
公开(公告)日：2010-07-01
申请号：US12663134
申请日：2008-05-29
申请人： Masamichi Nomura , Kenjiro Koizumi , Shigeru Kasai
发明人： Masamichi Nomura , Kenjiro Koizumi , Shigeru Kasai
IPC分类号： H02K7/09
CPC分类号： H01L21/68792 , C23C14/505 , H01J37/32761
摘要： A rotary floater (30) for supporting an object to be processed (W) is floated by the magnetic attraction of a floating electromagnet assembly (F), and the rotary floater (30) is rotated by the magnetic attraction of a rotary electromagnet assembly (R) while its horizontal position being controlled by the magnetic attraction of a positioning electromagnet assembly (H). The floating electromagnet assembly (F) causes the magnetic attraction to act vertically upwardly, so that the rotary floater (30) is floated and suspended without contact with the inner wall of a processing container (2).
摘要翻译： 用于支撑待加工物体（W）的旋转浮子（30）通过浮动电磁体组件（F）的磁吸引而浮起，旋转浮子（30）通过旋转电磁体组件 R），而其水平位置由定位电磁铁组件（H）的磁吸引力控制。 浮动电磁体组件（F）使得磁吸引力垂直向上作用，使得旋转浮子（30）浮动并悬挂而不与处理容器（2）的内壁接触。
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公开(公告)号：US08299671B2
公开(公告)日：2012-10-30
申请号：US12663134
申请日：2008-05-29
申请人： Masamichi Nomura , Kenjiro Koizumi , Shigeru Kasai
发明人： Masamichi Nomura , Kenjiro Koizumi , Shigeru Kasai
CPC分类号： H01L21/68792 , C23C14/505 , H01J37/32761
摘要： A rotary floater (30) for supporting an object to be processed (W) is floated by the magnetic attraction of a floating electromagnet assembly (F), and the rotary floater (30) is rotated by the magnetic attraction of a rotary electromagnet assembly (R) while its horizontal position being controlled by the magnetic attraction of a positioning electromagnet assembly (H). The floating electromagnet assembly (F) causes the magnetic attraction to act vertically upwardly, so that the rotary floater (30) is floated and suspended without contact with the inner wall of a processing container (2).
摘要翻译： 用于支撑待加工物体（W）的旋转浮子（30）通过浮动电磁体组件（F）的磁吸引而浮起，旋转浮子（30）通过旋转电磁体组件 R），而其水平位置由定位电磁铁组件（H）的磁吸引力控制。 浮动电磁体组件（F）使得磁吸引力垂直向上作用，使得旋转浮子（30）浮动并悬挂而不与处理容器（2）的内壁接触。
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公开(公告)号：US6121579A
公开(公告)日：2000-09-19
申请号：US807772
申请日：1997-02-27
申请人： Kazutsugu Aoki , Wataru Okase , Hironori Yagi , Masamichi Nomura
发明人： Kazutsugu Aoki , Wataru Okase , Hironori Yagi , Masamichi Nomura
CPC分类号： H01L21/67115 , C23C16/481 , C30B25/10 , C30B25/14
摘要： A heat treating apparatus comprises a process chamber within which a wafer is subjected to a heat treatment. A supporting plate for supporting the wafer is arranged within the process chamber. A process gas is supplied from above into the process chamber. A main heating means for heating the wafer is arranged below the process chamber, with a transmitting window interposed therebetween. The main heating means includes a plurality of heating sources for irradiating the supporting plate with heat rays so as to heat the wafer indirectly and a rotatable table having the heating sources arranged on the front surface thereof. The heat treating apparatus also comprises an auxiliary heating means for compensating for an uneven temperature caused on the surface of the wafer by the main heating means. The heating source of the auxiliary heating means is arranged on the surface of the rotatable table together with the heating sources of the main heating means, and the heat output from the heating source of the auxiliary heating means can be controlled independently of the heat output from the heating sources of the main heating means.
摘要翻译： 热处理装置包括处理室，在该处理室内对晶片进行热处理。 用于支撑晶片的支撑板布置在处理室内。 处理气体从上方供应到处理室中。 用于加热晶片的主加热装置布置在处理室的下方，其间插入有透射窗。 主加热装置包括多个加热源，用于向支撑板照射热射线以间接加热晶片，并且具有布置在其前表面上的加热源的可旋转工作台。 热处理装置还包括用于补偿由主加热装置在晶片表面引起的不均匀温度的辅助加热装置。 辅助加热装置的加热源与主加热装置的加热源一起布置在可旋转工作台的表面上，并且可以独立于来自辅助加热装置的加热源的热源的输出来控制从辅助加热装置的加热源输出的热量 主要加热装置的加热源。
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