公开(公告)号：US20210175196A1

公开(公告)日：2021-06-10

申请号：US16821095

申请日：2020-03-17

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Hsin-Yi Liao ,  Cheng-Kai Chang ,  Bo-Hao Ma ,  Chun-Chi Ke

IPC: H01L23/00

Abstract: A method for fabricating an electronic package is provided. A plurality of packaging structures are provided, each of which having a carrier and at least one electronic component disposed on the carrier. The plurality of packaging structures are disposed on a supporting plate. An encapsulation layer is formed on the supporting plate and encapsulates the plurality of packaging structures. Even if there are various types of electronic packages of different specifications in the market, the molds that the encapsulation layer uses can still be developed for a supporting plate of a certain specification. Therefore, the fabrication cost of the electronic package is reduced.

公开(公告)号：US20200350285A1

公开(公告)日：2020-11-05

申请号：US16554779

申请日：2019-08-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Ching Ho ,  Bo-Hao Ma ,  Yu-Ting Xue ,  Ching-Hung Tseng ,  Guan-Hua Lu ,  Hong-Da Chang

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48

Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

公开(公告)号：US11289346B2

公开(公告)日：2022-03-29

申请号：US16919433

申请日：2020-07-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chen-Yu Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kong-Toon Ng ,  Rui-Feng Tai ,  Bo-Hao Ma

IPC: H01L21/44 ,  H01L21/56 ,  H01L23/31 ,  H01L23/522 ,  H01L25/065 ,  H01L23/00 ,  H01L25/16 ,  H01L23/48 ,  H01L23/538 ,  H01L21/48 ,  H01L21/683 ,  H01L21/3105

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

公开(公告)号：US11195812B2

公开(公告)日：2021-12-07

申请号：US16821095

申请日：2020-03-17

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Hsin-Yi Liao ,  Cheng-Kai Chang ,  Bo-Hao Ma ,  Chun-Chi Ke

IPC: H01L23/00

Abstract: A method for fabricating an electronic package is provided. A plurality of packaging structures are provided, each of which having a carrier and at least one electronic component disposed on the carrier. The plurality of packaging structures are disposed on a supporting plate. An encapsulation layer is formed on the supporting plate and encapsulates the plurality of packaging structures. Even if there are various types of electronic packages of different specifications in the market, the molds that the encapsulation layer uses can still be developed for a supporting plate of a certain specification. Therefore, the fabrication cost of the electronic package is reduced.

公开(公告)号：US20200335447A1

公开(公告)日：2020-10-22

申请号：US16919433

申请日：2020-07-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chen-Yu Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kong-Toon Ng ,  Rui-Feng Tai ,  Bo-Hao Ma

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/522 ,  H01L25/065 ,  H01L23/00 ,  H01L25/16 ,  H01L23/48

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

公开(公告)号：US12125828B2

公开(公告)日：2024-10-22

申请号：US18464855

申请日：2023-09-11

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chi-Ching Ho ,  Bo-Hao Ma ,  Yu-Ting Xue ,  Ching-Hung Tseng ,  Guan-Hua Lu ,  Hong-Da Chang

IPC: H01L25/065 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522

CPC classification number: H01L25/0657 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/5226 ,  H01L24/13 ,  H01L2225/06541

Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

公开(公告)号：US11923337B2

公开(公告)日：2024-03-05

申请号：US16554779

申请日：2019-08-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Ching Ho ,  Bo-Hao Ma ,  Yu-Ting Xue ,  Ching-Hung Tseng ,  Guan-Hua Lu ,  Hong-Da Chang

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/522 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/5226 ,  H01L24/13 ,  H01L2225/06541

Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

公开(公告)号：US11315881B1

公开(公告)日：2022-04-26

申请号：US17122289

申请日：2020-12-15

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chi-Ching Ho ,  Bo-Hao Ma ,  Chee-Key Chung

IPC: H01L23/538 ,  H01L23/00 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: An electronic package is provided, in which at least one first electronic component is arranged on one surface of a circuit structure with circuit layers and a plurality of second electronic components are arranged on the other surface. The first electronic component can electrically bridge two of the plurality of second electronic components via the circuit layers to replace part of the circuit layers of the circuit structure, so that the circuit layers of the circuit structure can maintain a larger wiring specification and reduce the number of circuit layers, thereby improving the process yield.

公开(公告)号：US10741500B2

公开(公告)日：2020-08-11

申请号：US15971534

申请日：2018-05-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chen-Yu Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kong-Toon Ng ,  Rui-Feng Tai ,  Bo-Hao Ma

IPC: H01L23/48 ,  H01L23/538 ,  H01L23/31 ,  H01L23/522 ,  H01L25/065 ,  H01L23/00 ,  H01L25/16

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

公开(公告)号：US20190237374A1

公开(公告)日：2019-08-01

申请号：US15971534

申请日：2018-05-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chen-Yu Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kong-Toon Ng ,  Rui-Feng Tai ,  Bo-Hao Ma

IPC: H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01L25/065

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.