公开(公告)号：US20180233825A1

公开(公告)日：2018-08-16

申请号：US15887413

申请日：2018-02-02

Applicant: Sony Interactive Entertainment Inc.

Inventor： Masayuki Pak ,  Tetsufumi Nozawa

IPC: H01Q9/04 ,  H01Q1/48 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H01P11/00

CPC classification number: H01Q9/045 ,  H01P3/006 ,  H01P5/028 ,  H01P11/001 ,  H01Q1/48 ,  H01Q9/0421 ,  H05K1/0237 ,  H05K1/0253 ,  H05K1/0268 ,  H05K1/115 ,  H05K1/117 ,  H05K1/18 ,  H05K3/34 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09727 ,  H05K2201/10098

Abstract: A communication apparatus includes a signal line that connects an antenna and a wireless communication module to each other, the signal line having a portion where the signal line is divided in part into sections, with an adjacent portion adjacent to the divided portion of the signal line being greater in line width than a main body portion of the signal line; a first ground pattern disposed to face the main body portion; and a second ground pattern disposed to face the adjacent portion. The distance from the adjacent portion to the second ground pattern is longer than the distance from the main body portion to the first ground pattern. The antenna and the wireless communication module are connected to each other through the signal line and a solder adhered to the adjacent portion.

公开(公告)号：US10854981B2

公开(公告)日：2020-12-01

申请号：US15887413

申请日：2018-02-02

Applicant: Sony Interactive Entertainment Inc.

Inventor： Masayuki Pak ,  Tetsufumi Nozawa

IPC: H01Q9/04 ,  H01Q1/48 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H01P11/00 ,  H05K1/18 ,  H01P5/02 ,  H01P3/00

Abstract: A communication apparatus includes a signal line that connects an antenna and a wireless communication module to each other, the signal line having a portion where the signal line is divided in part into sections, with an adjacent portion adjacent to the divided portion of the signal line being greater in line width than a main body portion of the signal line; a first ground pattern disposed to face the main body portion; and a second ground pattern disposed to face the adjacent portion. The distance from the adjacent portion to the second ground pattern is longer than the distance from the main body portion to the first ground pattern. The antenna and the wireless communication module are connected to each other through the signal line and a solder adhered to the adjacent portion.