公开(公告)号：US20150329695A1

公开(公告)日：2015-11-19

申请号：US14708715

申请日：2015-05-11

Applicant: TDK CORPORATION

Inventor： Yutaka SHIMIZU ,  Tsuyoshi SUGIYAMA ,  Hiroshi SHUTOH ,  Masaaki YAMASHITA

IPC: C08K3/22 ,  C08K5/13 ,  C08K5/18

CPC classification number: C08K3/22 ,  C08K5/13 ,  C08K5/18 ,  C08K2003/222 ,  C08L63/00

Abstract: An inorganic filler-containing epoxy resin cured product contains a magnesium oxide powder and has a maximum thermogravimetric mass loss rate ΔRmax of −0.20 mass percent/° C. or more within a temperature range of 300° C. to 500° C. The filling factor of the magnesium oxide powder in the inorganic filler-containing epoxy resin cured product is 45% to 63% by volume.

Abstract translation: 含有无机填料的环氧树脂固化物含有氧化镁粉末，在300℃〜500℃的温度范围内具有-0.20质量％/℃以上的最大热重质量损失率＆Dgr; Rmax。 无机填料的环氧树脂固化物中的氧化镁粉末的填充率为45〜63体积％。

公开(公告)号：US20200377647A1

公开(公告)日：2020-12-03

申请号：US16496816

申请日：2018-03-13

Applicant: TDK CORPORATION

Inventor： Keiji ENOMOTO ,  Masaaki YAMASHITA ,  Hiroshi SHUTOH ,  Tsuyoshi SUGIYAMA ,  Tomoyuki HARAI ,  Yutaka SHIMIZU

IPC: C08G59/40 ,  C08L63/10 ,  C08K3/38 ,  C08K5/5313 ,  C08K5/13 ,  C08K5/18 ,  C08J5/18 ,  B32B27/38 ,  B32B27/26

Abstract: A resin composition including a main agent containing an epoxy compound, a curing agent, and inorganic particles, the curing agent includes an aromatic compound in which a ratio of the number of carbon atoms constituting an aromatic ring to a total number of carbon atoms in one molecule is 85% or more, a content of the inorganic particles is 40 to 75 vol % based on a total amount of components other than a solvent, the inorganic particles include boron nitride particles and particles different from the boron nitride particles, and a content of the boron nitride particles is 3 to 35 vol % based on a total amount of components other than a solvent.

公开(公告)号：US20200317567A1

公开(公告)日：2020-10-08

申请号：US16835553

申请日：2020-03-31

Applicant: TDK CORPORATION

Inventor： Yasuhide YAMASHITA ,  Masaaki YAMASHITA

IPC: C03C25/1095 ,  C03C25/42 ,  C03C25/47 ,  B32B5/02 ,  B32B5/26

Abstract: A substrate includes a fabric-like member. First inorganic fillers exist on a surface of the fabric-like member.

公开(公告)号：US20180105674A1

公开(公告)日：2018-04-19

申请号：US15561741

申请日：2016-04-28

Applicant: TDK CORPORATION

Inventor： Hiroshi SHUTOH ,  Masaaki YAMASHITA ,  Tsuyoshi SUGIYAMA

IPC: C08K5/13 ,  C08L63/00 ,  C08G59/62

CPC classification number: C08K5/13 ,  B32B27/38 ,  C07C39/15 ,  C08G59/62 ,  C08L63/00

Abstract: A resin composition includes an epoxy compound, a first triphenylbenzene compound, and a second triphenylbenzene compound. A ratio M (mol %) expressed by M (mol %)=(M1/M2)×100 is from 0.2 mol % to 16.3 mol %, where M1 is the number of moles (mol) of an alkoxy group contained in the second triphenylbenzene compound, and M2 is sum of the number of moles (mol) of a hydroxyl group contained in the first triphenylbenzene compound, the number of moles (mol) of the hydroxyl group contained in the second triphenylbenzene compound, and the number of moles (mol) of the alkoxy group contained in the second triphenylbenzene compound.