公开(公告)号：US20220293490A1

公开(公告)日：2022-09-15

申请号：US17635474

申请日：2020-07-28

Applicant: TDK Electronics AG

Inventor： Markus Koini ,  Markus Puff ,  Jan lnle ,  Nele Reimer

IPC: H01L23/473

Abstract: A cooling system for a semiconductor device. The system includes a first heat sink containing a ceramic material as a main component and a semiconductor device having a first contact surface. The first heat sink serves for cooling the semiconductor device and as an electrical insulator with respect to the semiconductor device. Furthermore, a first metal-containing layer is provided on at least one outer surface of the first heat sink, the first metal-containing layer having a size at least equal to the area of the first contact surface of the semiconductor device. The semiconductor device is attached to the first metal-containing layer via the contact surface by a first bonding layer formed by soldering or sintering.

公开(公告)号：US10692655B2

公开(公告)日：2020-06-23

申请号：US16308224

申请日：2017-06-12

Applicant: TDK Electronics AG

Inventor： Fabian Beck ,  Florian Böhm ,  Jürgen Konrad ,  Markus Koini

IPC: H01G2/00 ,  H01G2/06 ,  H01G4/08 ,  H01G4/12 ,  H01G4/30 ,  H01G4/228 ,  H01G4/232 ,  H01C7/00 ,  H01G4/005 ,  H03H1/00 ,  H05K1/18

Abstract: A filter component for filtering an interference signal. The filter component includes at least one multilayer ceramic capacitor having a main body, in which multiple ceramic layers and internal electrodes are stacked one above another, and connection contacts are arranged at the main body. The ceramic layers include a lead lanthanum zirconate titanate ceramic, for example.

公开(公告)号：US20190267193A1

公开(公告)日：2019-08-29

申请号：US16308224

申请日：2017-06-12

Applicant: TDK Electronics AG

Inventor： Fabian Beck ,  Florian Böhm ,  Jürgen Konrad ,  Markus Koini

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H01G4/232 ,  H05K1/18 ,  H03H1/00

Abstract: A filter component for filtering an interference signal. The filter component includes at least one multilayer ceramic capacitor having a main body, in which multiple ceramic layers and internal electrodes are stacked one above another, and connection contacts are arranged at the main body. The ceramic layers include a lead lanthanum zirconate titanate ceramic, for example.

公开(公告)号：US20240230156A9

公开(公告)日：2024-07-11

申请号：US18546555

申请日：2022-02-14

Applicant: TDK Electronics AG

Inventor： Markus Koini ,  Michael Krenn ,  Markus Puff ,  Stephan Bigl

IPC: F24H3/04 ,  F24H9/1863 ,  H05B3/26

CPC classification number: F24H3/0447 ,  F24H9/1872 ,  H05B3/265 ,  H05B3/267 ,  F24H2250/04 ,  H05B2203/02

Abstract: A PTC heating element for an electric heater having a PTC element, an electrode formed on a surface of the PTC element for electrically contacting the PTC element, at least one additional contact for electrically connecting the electrode of the PTC element, and a carrier layer. The carrier layer is electrically insulating, the thickness of the PTC element is ≤500 μm, and the installation height of the PTC heating element is between 500 μm and 2500 μm. Also disclosed is an electric heater and use of the PTC heating element in a motor vehicle.

公开(公告)号：US11462476B2

公开(公告)日：2022-10-04

申请号：US16961078

申请日：2019-01-30

Applicant: TDK Electronics AG

Inventor： Thomas Feichtinger ,  Johann Pichler ,  Nele Reimer ,  Markus Koini ,  Manfred Schweinzger

IPC: H01L23/532 ,  H01L23/15 ,  H01L23/36

Abstract: An electronic device is disclosed. In an embodiment an electronic device includes at least one first carrier and at least one semiconductor chip, wherein the first carrier has a cavity in which the semiconductor chip is arranged.

公开(公告)号：US11387045B2

公开(公告)日：2022-07-12

申请号：US16976026

申请日：2019-02-15

Applicant: TDK Electronics AG

Inventor： Markus Koini ,  Thomas Wippel ,  Franz Rinner

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/38

Abstract: A multilayer component is disclosed. In an embodiment, a multilayer component includes a main body with first and second inner electrodes, wherein the first and second electrodes are alternately arranged in an interior of the main body and electrically insulated from one another and an outer contact configured to provide external contact, wherein the outer contact comprises at least two first strip-shaped conductor tracks arranged on a first surface of the main body, wherein each first conductor track is electrically connected to one of the first inner electrodes, wherein the outer contact comprises at least two second strip-shaped conductor tracks arranged on a second surface of the main body, wherein each second conductor track is electrically connected to one of the second inner electrodes, and wherein embossings in adjacent first conductor tracks or second conductor tracks are arranged offset with respect to one another.

公开(公告)号：US20240133587A1

公开(公告)日：2024-04-25

申请号：US18546555

申请日：2022-02-14

Applicant: TDK Electronics AG

Inventor： Markus Koini ,  Michael Krenn ,  Markus Puff ,  Stephan Bigl

IPC: F24H3/04 ,  F24H9/1863 ,  H05B3/26

CPC classification number: F24H3/0447 ,  F24H9/1872 ,  H05B3/265 ,  H05B3/267 ,  F24H2250/04 ,  H05B2203/02

Abstract: A PTC heating element for an electric heater having a PTC element, an electrode formed on a surface of the PTC element for electrically contacting the PTC element, at least one additional contact for electrically connecting the electrode of the PTC element, and a carrier layer. The carrier layer is electrically insulating, the thickness of the PTC element is ≤500 μm, and the installation height of the PTC heating element is between 500 μm and 2500 μm. Also disclosed is an electric heater and use of the PTC heating element in a motor vehicle.

公开(公告)号：US20210066199A1

公开(公告)日：2021-03-04

申请号：US16961078

申请日：2019-01-30

Applicant: TDK Electronics AG

Inventor： Thomas Feichtinger ,  Johann Pichler ,  Nele Reimer ,  Markus Koini ,  Manfred Schweinzger

IPC: H01L23/532 ,  H01L23/15 ,  H01L23/36

Abstract: An electronic device is disclosed. In an embodiment an electronic device includes at least one first carrier and at least one semiconductor chip, wherein the first carrier has a cavity in which the semiconductor chip is arranged.

公开(公告)号：US20200266002A1

公开(公告)日：2020-08-20

申请号：US16866616

申请日：2020-05-05

Applicant: TDK Electronics AG

Inventor： Fabian Beck ,  Florian Böhm ,  Jürgen Konrad ,  Markus Koini

IPC: H01G4/30 ,  H05K1/18 ,  H03H1/00 ,  H01G4/232 ,  H01G4/12 ,  H01G4/005

Abstract: A filter component for filtering an interference signal comprises at least one multilayer ceramic capacitor (2, 3, 5) having a main body (6), in which a plurality of ceramic layers (9) and internal electrodes (10, 11, 12) are stacked one above another, and wherein connection contacts (7, 8) are arranged at the main body (6). The ceramic layers (9) comprise a lead lanthanum zirconate titanate ceramic, for example.