公开(公告)号：US20200181390A1

公开(公告)日：2020-06-11

申请号：US16316283

申请日：2017-06-15

Applicant: TESA SE

Inventor： Markus BRODBECK ,  Alexander FISCHER ,  Marco KUPSKY

IPC: C08L63/00 ,  C08L75/04 ,  C09J163/00 ,  C09J175/04

Abstract: The invention relates to a dispersion comprising one or more protic solvents as dispersion medium and also, as base components dispersed therein, one or more matrix polymers, one or more epoxides, at least one kind of a modified compound of the polyamine adduct type which is insoluble in the epoxides, where the at least one modified polyamine adduct is in dispersion in particulate form, with 90% of the particles having a particle size in the range from 0.1 to 10 μm as determined by laser diffractometry.

公开(公告)号：US20210222037A1

公开(公告)日：2021-07-22

申请号：US16097109

申请日：2017-04-06

Applicant: TESA SE

Inventor： Thilo DOLLASE ,  Markus BRODBECK ,  Alexander FISCHER ,  Marco KUPSKY ,  Alexander PRENZEL

IPC: C09J133/06 ,  C08F220/32 ,  C09J7/38

Abstract: The invention relates to a polymer obtainable by the radical polymerization of at least one monomer, namely one or more (meth)acrylate monomers and optionally, in addition, vinylic comonomers, wherein the polymer has a molar mass MW of at least 5,000 g/mol and at most 200,000 g/mol and at least one of the monomers is functionalized with at least one epoxy group, wherein the proportion of the epoxide-functionalized monomer(s) (a) is more than 30 wt %.

公开(公告)号：US20190144724A1

公开(公告)日：2019-05-16

申请号：US16097888

申请日：2017-04-18

Applicant: TESA SE

Inventor： Thilo DOLLASE ,  Markus BRODBECK ,  Alexander FISCHER ,  Marco KUPSKY ,  Matthias KOOP

IPC: C09J163/00 ,  C09J133/08 ,  C09J133/10 ,  C08K5/19 ,  C08K5/45

CPC classification number: C09J163/00 ,  C08K5/0025 ,  C08K5/02 ,  C08K5/17 ,  C08K5/19 ,  C08K5/45 ,  C08L33/068 ,  C09J133/08 ,  C09J133/10 ,  C09J179/00

Abstract: The invention relates to a thermally curable adhesive compound consisting of the following components: (A) 4.9 to 34.9 wt % (relative to the total amount of the curable adhesive compound) of an epoxide-functionalized (co)polymer having a weight-average molar mass in the range of 5,000 g/mol to 200,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one thermally activatable curing agent for a cationic curing of epoxides, (C) 65 to 95 wt % (relative to the total amount of the curable adhesive compound) of at least one type of matrix polymer as a film-forming agent, (D) optionally 0 to 30 wt % of additional components.

公开(公告)号：US20160121590A1

公开(公告)日：2016-05-05

申请号：US14895951

申请日：2014-05-26

Applicant: TESA SE

Inventor： Kim SULKAKOSKI ,  Frank HANNEMANN ,  Alexander FISCHER

IPC: B32B37/12 ,  B32B37/10 ,  B32B38/00

CPC classification number: B32B37/12 ,  B32B37/10 ,  B32B38/0008 ,  B32B2457/20 ,  B32B2457/208 ,  B32B2551/00 ,  C09J5/06 ,  C09J2205/31 ,  F16B11/006

Abstract: A method for adhesively bonding two substrates using an adhesive film that bonds adhesively by activation with heat, wherein the adhesive film is not adhesive at room temperature, in a first step the adhesive film is laminated in a heated state onto the first of the substrates to be adhesively bonded, after the lamination, the side of the adhesive film that is not in contact with the first substrate to be adhesively bonded is initially exposed in order to be able to be brought into contact with the second substrate to be adhesively bonded, the adhesive film is activated by irradiating with electromagnetic radiation in the near infrared range (NIR), by heating to a temperature TK above the lowest activation temperature TA,u, and the adhesive bonding with the second substrate to be adhesively bonded is brought about by means of the activation by the NIR radiation.

Abstract translation: 一种使用粘合剂膜粘接两片基板的方法，所述粘合剂膜通过热激活粘结，其中所述粘合膜在室温下不粘合，在第一步骤中，所述粘合膜以加热状态层压到所述第一基板上， 在层压之后，粘合剂膜的与未粘合的第一基板接触的一侧最初被暴露以便能够与第二基板接触以进行粘合， 通过加热至高于最低活化温度TA，u的温度TK，通过在近红外范围（NIR）中照射电磁辐射来激活粘合膜，并且通过手段使与粘合粘合的第二基底的粘合剂粘合 的NIR辐射激活。