Abstract:
Reactive adhesive film system, comprising a first reactive adhesive film (A) and a second reactive adhesive film (B); use of the reactive adhesive film system described herein for the bonding of materials with nonpolar surfaces; composites comprising the reactive adhesive film system; and methods for the production of the reactive adhesive film system and method for increasing the adhesive properties of the reactive adhesive film system on nonpolar substrates.
Abstract:
Thermally vulcanisable, meltable adhesives and processes have a meltable polybutadiene-polyurethane, ground sulphur and optionally at least one vulcanisation accelerator, at least one filling material, at least one epoxide resin, at least one tackifier resin, bitumen, at least one softener and further auxiliary and additive materials, wherein said adhesives and processes can be thermally vulcanised within a temperature range of 130° C. to 230° C., such that same, as well as an adhesive strip produced from same, can be used for adhesion and/or sealing in the automotive industry, as well as in structural work on oiled sheet metal, and in the painting line on e-coated or otherwise painted sheet metal, for example, for crimp fold adhesion, for crimp fold sealing, for seam sealing, for lining adhesion, for hole closure and much more.
Abstract:
A method for adhesively bonding two substrates using an adhesive film that bonds adhesively by activation with heat, wherein the adhesive film is not adhesive at room temperature, in a first step the adhesive film is laminated in a heated state onto the first of the substrates to be adhesively bonded, after the lamination, the side of the adhesive film that is not in contact with the first substrate to be adhesively bonded is initially exposed in order to be able to be brought into contact with the second substrate to be adhesively bonded, the adhesive film is activated by irradiating with electromagnetic radiation in the near infrared range (NIR), by heating to a temperature TK above the lowest activation temperature TA,u, and the adhesive bonding with the second substrate to be adhesively bonded is brought about by means of the activation by the NIR radiation.