-
公开(公告)号：US11855540B2
公开(公告)日：2023-12-26
申请号：US16364492
申请日：2019-03-26
Applicant: TEXAS INSTRUMENTS INCORPORATED
CPC classification number: H02M3/1582 , H01F27/2804 , H01F41/04 , H01F2038/026
Abstract: A device includes a circuit assembly and a first conductive winding support having a first end attached to the circuit assembly and having a first winding support surface a first distance from the circuit assembly. The device also includes a second conductive winding support having a second end attached to the circuit assembly and having a second winding support surface a second distance from the circuit assembly, the second distance being different than the first distance. A conductive winding has first and second winding ends. The first winding end is attached to the first winding support surface, and the second winding end is attached to the second winding support surface.
-
公开(公告)号：US11744020B2
公开(公告)日：2023-08-29
申请号：US17537721
申请日：2021-11-30
Applicant: Texas Instruments Incorporated
Inventor： Kyle Brent Norell , Claude Albert Fernandez , Charles Allen DeVries
CPC classification number: H05K1/181 , H05K1/111 , H05K3/222 , H05K3/284 , H05K3/288 , H05K3/3421 , H05K2201/1003 , H05K2201/10015 , H05K2201/1031 , H05K2201/10174 , H05K2201/10628 , H05K2203/1316
Abstract: An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.
-
公开(公告)号：US20230171894A1
公开(公告)日：2023-06-01
申请号：US17537721
申请日：2021-11-30
Applicant: Texas Instruments Incorporated
Inventor： Kyle Brent Norell , Claude Albert Fernandez , Charles Allen DeVries
CPC classification number: H05K1/181 , H05K1/111 , H05K3/222 , H05K3/284 , H05K3/288 , H05K3/3421 , H05K2201/1003 , H05K2201/10015 , H05K2201/10174 , H05K2201/1031 , H05K2201/10628 , H05K2203/1316
Abstract: An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.
-
公开(公告)号：US20200313555A1
公开(公告)日：2020-10-01
申请号：US16364492
申请日：2019-03-26
Applicant: TEXAS INSTRUMENTS INCORPORATED
Abstract: A device includes a circuit assembly and a first conductive winding support having a first end attached to the circuit assembly and having a first winding support surface a first distance from the circuit assembly. The device also includes a second conductive winding support having a second end attached to the circuit assembly and having a second winding support surface a second distance from the circuit assembly, the second distance being different than the first distance. A conductive winding has first and second winding ends. The first winding end is attached to the first winding support surface, and the second winding end is attached to the second winding support surface.
-
-
-
Search Results
4
records
(took 0.012 seconds)
