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公开(公告)号:US20250030413A1
公开(公告)日:2025-01-23
申请号:US18224830
申请日:2023-07-21
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Anant Kamath , Taisuke Kazama , Sombuddha Chakraborty
IPC: H03K17/06 , H03K17/687
Abstract: An integrated circuit is provided which comprises a transistor and a driver coupled to a gate of the transistor. In at least one example, the driver controls an operation of the transistor, wherein the driver is operable in a first configuration as a low-side gate driver for a voltage regulator, and wherein the transistor is operable in the first configuration as a low-side switch for the voltage regulator. In at least one example, the driver is operable in a second configuration as a high-side gate driver for the voltage regulator, and wherein the transistor is operable in the second configuration as a high-side switch for the voltage regulator.
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公开(公告)号:US20190207519A1
公开(公告)日:2019-07-04
申请号:US15859031
申请日:2017-12-29
Applicant: Texas Instruments Incorporated
Inventor: Sombuddha Chakraborty , Jeffery Lee Nilles , Mervin John , Farzad Sahandiesfanjani , Yogesh Kumar Ramadass
CPC classification number: H02M3/1588 , H02M1/088 , H02M1/32 , H02M1/36 , H02M3/158 , H02M2001/0022 , H02M2001/0048 , H02M2001/0054
Abstract: In described examples, a DC-DC converter provides electrical power. In response to an input voltage falling below a high voltage operation threshold, the converter repeatedly performs a first normal (N) phase and a second N phase. The first N phase includes delivering power through an inductor from the input voltage. The second N phase includes coupling an input terminal of the inductor to a ground. In response to the input voltage rising above a normal operation threshold, the converter performs a first high voltage (HV) phase, then a second HV phase, then a third HV phase, then the second HV phase, and then repeats from the first HV phase. The first HV phase includes delivering power through the inductor from the input voltage and charging a flying capacitor. The second HV phase includes coupling the input terminal of the inductor to the ground. The third HV phase includes delivering power through the inductor by discharging the flying capacitor through the inductor.
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公开(公告)号:US11368089B2
公开(公告)日:2022-06-21
申请号:US16840087
申请日:2020-04-03
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Sombuddha Chakraborty , Hakan Oner , Yogesh Kumar Ramadass
Abstract: Described systems, methods, and circuitries use an interleaved multi-level converter to convert an input signal received at an input node into an output signal at an output node. In one example, a power conversion system includes a first multi-level switching circuit, a second multi-level switching circuit, and a control circuit. The first multi-level switching circuit and the second multi-level switching circuit are coupled to a switching node, the input node, and a reference node. The control circuit is configured to generate, based on the output signal, switching control signals as pulse width modulated signals having a duty cycle to control the output signal and provide the switching control signals to the first multi-level switching circuit and the second multi-level switching circuit.
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公开(公告)号:US20210375540A1
公开(公告)日:2021-12-02
申请号:US17240656
申请日:2021-04-26
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Yuki Sato , Kenji Otake , Zhemin Zhang , Byron Lovell Williams , Dongbin Hou , Sombuddha Chakraborty
Abstract: A laminate embedded core and coil structure comprises a magnetic core embedded in a laminate structure that includes two types of laminates. A first laminate embeds the coils of the structure and a second laminate fills space between the magnetic core and the first laminate, as well as space below the magnetic core and lower surface of the first laminate. The first and second laminates form a laminate structure that protects and improves isolation of the magnetic components. Solder resist encloses the laminate structure, magnetic core and coils. The laminate embedded core and coil structure may be assembled on a transformer leadframe of various types using non-conductive paste.
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公开(公告)号:US10601304B2
公开(公告)日:2020-03-24
申请号:US15858931
申请日:2017-12-29
Applicant: Texas Instruments Incorporated
Inventor: Timothy McRae , Aleksandar Prodic , Sombuddha Chakraborty , Alvaro Aguilar , William James McIntyre
Abstract: In methods, apparatus, systems, and articles of manufacture to a high efficient hybrid power converter, an example apparatus includes: a switched capacitor (SC) converter to generate a first voltage based on a voltage source; and a direct current-to-direct current (DC-DC) converter to generate a second voltage based on the voltage source of the apparatus, the difference between the first voltage and the second voltage corresponding to an output voltage.
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公开(公告)号:US09780661B2
公开(公告)日:2017-10-03
申请号:US14926555
申请日:2015-10-29
Applicant: Texas Instruments Incorporated
Inventor: Sombuddha Chakraborty , Yogesh Kumar Ramadass
CPC classification number: H02M3/158 , H02M1/08 , H02M3/06 , H02M3/156 , H02M3/1588 , H02M2001/0009 , H02M2003/072 , H02M2003/1566
Abstract: Switch mode power supplies and integrated circuits are presented to provide a DC output voltage signal using high and low side switches, with a switching control circuit to turn off the high side switch and engage an active shunt circuit to provide a reduced voltage to continue converter operation to accommodate high input voltage transients when the DC input voltage exceeds a threshold voltage without requiring an oversized low side switch for improved efficiency through reduced switching and conduction losses in normal operation.
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公开(公告)号:US20250081476A1
公开(公告)日:2025-03-06
申请号:US18459230
申请日:2023-08-31
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Hidetoshi Inoue , Kenji Otake , Sombuddha Chakraborty , Taisuke Kazama
IPC: H10N35/00 , H01L23/00 , H01L23/495 , H01L25/065
Abstract: A packaged integrated circuit (IC) includes a package substrate, an electronic device on the package substrate, and metal interconnects coupled between the electronic device and the package substrate. The packaged IC also includes an insulation material on the package substrate and encapsulating the electronic device. The insulation material surrounds the metal interconnects. An inductor is over the electronic device and is coupled to the package substrate. A magnetic material is on the insulation material and encapsulates the inductor. The magnetic material is different from the insulation material.
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公开(公告)号:US20210375537A1
公开(公告)日:2021-12-02
申请号:US17405017
申请日:2021-08-17
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Dongbin Hou , Sombuddha Chakraborty , Kenji Kawano , Jeffrey Morroni , Yuki Sato
Abstract: A device includes a first inductor and a second inductor reversely coupled with the first inductor. The first and second inductors have overlapping windings. The device also includes a housing for the first and second inductor. The housing is filled with a magnetic molding compound.
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公开(公告)号:US10581312B2
公开(公告)日:2020-03-03
申请号:US15859039
申请日:2017-12-29
Applicant: Texas Instruments Incorporated
Abstract: In described examples, a system regulates provision of DC-DC electrical power. The system includes a DC-DC converter, an input voltage node to receive an input voltage, a current source, a voltage source node, and a ground switch. The DC-DC converter includes a flying capacitor and multiple converter switches. The current source is coupled between the input voltage node and a top plate of the flying capacitor, to provide current to the top plate when the current source is activated by an activation voltage. The voltage source node is coupled to the input voltage node and to the current source, to provide the activation voltage to the current source, such that the activation voltage is not higher than a selected voltage between: a breakdown voltage of the converter switches; and a maximum value of the input voltage minus the breakdown voltage. The ground switch is coupled between a bottom plate of the flying capacitor and a ground.
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公开(公告)号:US20190207505A1
公开(公告)日:2019-07-04
申请号:US15859039
申请日:2017-12-29
Applicant: Texas Instruments Incorporated
Abstract: In described examples, a system regulates provision of DC-DC electrical power. The system includes a DC-DC converter, an input voltage node to receive an input voltage, a current source, a voltage source node, and a ground switch. The DC-DC converter includes a flying capacitor and multiple converter switches. The current source is coupled between the input voltage node and a top plate of the flying capacitor, to provide current to the top plate when the current source is activated by an activation voltage. The voltage source node is coupled to the input voltage node and to the current source, to provide the activation voltage to the current source, such that the activation voltage is not higher than a selected voltage between: a breakdown voltage of the converter switches; and a maximum value of the input voltage minus the breakdown voltage. The ground switch is coupled between a bottom plate of the flying capacitor and a ground.
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