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公开(公告)号:US20150228566A1
公开(公告)日:2015-08-13
申请号:US14692283
申请日:2015-04-21
Applicant: Texas Instruments Incorporated
Inventor: Sreenivasan K. KODURI
IPC: H01L23/495 , H01L23/31 , H01L23/482 , H01L23/367
CPC classification number: H01L23/49568 , H01L23/3114 , H01L23/34 , H01L23/3677 , H01L23/4822 , H01L23/49506 , H01L23/49517 , H01L23/49541 , H01L2924/0002 , H05K1/0203 , H05K1/11 , H05K1/111 , H05K2201/10636 , H01L2924/00
Abstract: A plastic package for high power has a pair of oblong metal pins exposed from a surface of the plastic, the pins straddling a corner of the package; each pin has a long axis, the long axes of the pair forming a non-orthogonal angle. Package further includes a chip assembly pad, acting as a thermal spreader and semiconductor chip.
Abstract translation: 用于高功率的塑料封装具有从塑料表面暴露的一对长方形金属销,跨过包装角的销钉; 每个销具有长轴,该对的长轴形成非正交角。 封装还包括用作散热器和半导体芯片的芯片组装垫。
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公开(公告)号:US20210390237A1
公开(公告)日:2021-12-16
申请号:US17245253
申请日:2021-04-30
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Ashish KHANDELWAL , Sreenivasan K. KODURI , Nikhil GUPTA , Timothy W. FISCHER
IPC: G06F30/3308 , G06F30/367 , G06F30/373 , G06N3/08 , G06N20/20
Abstract: A technique for designing circuits including receiving a data object representing a circuit for a first process technology, the circuit including a first sub-circuit, the first sub-circuit including a first electrical component and a second electrical component arranged in a first topology; identifying the first sub-circuit in the data object by comparing the first topology to a stored topology, the stored topology associated with the first process technology; identifying a first set of physical parameter values associated with first electrical component and the second electrical component of the first sub-circuit; determining a set of performance parameter values for the first sub-circuit based on a first machine learning model of the first sub-circuit and the identified set of physical parameters; converting the identified first sub-circuit to a second sub-circuit for the second process technology based on the determined set of performance parameter values; and outputting the second sub-circuit.
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公开(公告)号:US20210390233A1
公开(公告)日:2021-12-16
申请号:US17245083
申请日:2021-04-30
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Ashish KHANDELWAL , Nikhil GUPTA , Sreenivasan K. KODURI , Timothy W. FISCHER
IPC: G06F30/27 , G06N3/08 , G06F30/392 , G06F30/398 , G06F30/337
Abstract: A technique for designing circuits including receiving a data object representing a circuit for a first process technology, the circuit including a first sub-circuit, the first sub-circuit including a first electrical component and a second electrical component arranged in a first topology; identifying the first sub-circuit in the data object by comparing the first topology to a stored topology, the stored topology associated with the first process technology; identifying a first set of physical parameter values associated with first electrical component and the second electrical component of the first sub-circuit; determining a set of performance parameter values for the first sub-circuit based on a first machine learning model of the first sub-circuit and the identified set of physical parameters; converting the identified first sub-circuit to a second sub-circuit for the second process technology based on the determined set of performance parameter values; and outputting the second sub-circuit.
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公开(公告)号:US20200343165A1
公开(公告)日:2020-10-29
申请号:US16394564
申请日:2019-04-25
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Sreenivasan K. KODURI , Abram M. CASTRO
IPC: H01L23/495 , H01L23/50
Abstract: In some examples, a device comprises an electronic component having multiple electrical connectors, the multiple electrical connectors configured to couple to a printed circuit board (PCB) and having a first footprint. The device also comprises a multi-lead adapter comprising multiple rows of leads arranged in parallel, the leads in the rows configured to couple to the electrical connectors of the electronic component and having a second footprint that has a different size than the first footprint.
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公开(公告)号:US20210390239A1
公开(公告)日:2021-12-16
申请号:US17245057
申请日:2021-04-30
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Ashish KHANDELWAL , Sreenivasan K. KODURI , Nikhil GUPTA , Timothy W. FISCHER
IPC: G06F30/392 , G06N3/08 , G06N3/04
Abstract: A technique for designing circuits including receiving a data object representing a circuit for a first process technology, the circuit including a first sub-circuit, the first sub-circuit including a first electrical component and a second electrical component arranged in a first topology; identifying the first sub-circuit in the data object by comparing the first topology to a stored topology, the stored topology associated with the first process technology; identifying a first set of physical parameter values associated with first electrical component and the second electrical component of the first sub-circuit; determining a set of performance parameter values for the first sub-circuit based on a first machine learning model of the first sub-circuit and the identified set of physical parameters; converting the identified first sub-circuit to a second sub-circuit for the second process technology based on the determined set of performance parameter values; and outputting the second sub-circuit.
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公开(公告)号:US20210390234A1
公开(公告)日:2021-12-16
申请号:US17245306
申请日:2021-04-30
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Nikhil GUPTA , Timothy W. FISCHER , Ashish KHANDELWAL , Sreenivasan K. KODURI
IPC: G06F30/27 , G06F30/337 , G06K9/62 , G06N20/00
Abstract: A technique for designing circuits including receiving a data object representing a circuit for a first process technology, the circuit including a first sub-circuit, the first sub-circuit including a first electrical component and a second electrical component arranged in a first topology; identifying the first sub-circuit in the data object by comparing the first topology to a stored topology, the stored topology associated with the first process technology; identifying a first set of physical parameter values associated with first electrical component and the second electrical component of the first sub-circuit; determining a set of performance parameter values for the first sub-circuit based on a first machine learning model of the first sub-circuit and the identified set of physical parameters; converting the identified first sub-circuit to a second sub-circuit for the second process technology based on the determined set of performance parameter values; and outputting the second sub-circuit.
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公开(公告)号:US20180301403A1
公开(公告)日:2018-10-18
申请号:US15951003
申请日:2018-04-11
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Jeffrey MORRONI , Rajeev Dinkar JOSHI , Sreenivasan K. KODURI , Sujan Kundapur MANOHAR , Yogesh K. RAMADASS , Anindya PODDAR
IPC: H01L23/495 , H01L23/498 , H01L21/48 , H01L23/00
Abstract: A semiconductor package includes a leadframe, a semiconductor die attached to the leadframe, and a passive component electrically connected to the semiconductor die through the leadframe. The leadframe includes a cavity in a side of the leadframe opposite the semiconductor die, and at least a portion of the passive component resides within the cavity in a stacked arrangement.
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公开(公告)号:US20140345915A1
公开(公告)日:2014-11-27
申请号:US14451979
申请日:2014-08-05
Applicant: Texas Instruments Incorporated
Inventor: Sreenivasan K. KODURI
CPC classification number: H01L23/49568 , H01L23/3114 , H01L23/34 , H01L23/3677 , H01L23/4822 , H01L23/49506 , H01L23/49517 , H01L23/49541 , H01L2924/0002 , H05K1/0203 , H05K1/11 , H05K1/111 , H05K2201/10636 , H01L2924/00
Abstract: A plastic SON/QFN package for high power has a pair of oblong metal pins exposed from a surface of the plastic, the pins straddling a corner of the package; each pin has a long axis, the long axes of the pair forming a non-orthogonal angle.
Abstract translation: 用于高功率的塑料SON / QFN封装具有从塑料表面暴露的一对长方形金属销,跨过包装角的销钉; 每个销具有长轴,该对的长轴形成非正交角。
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公开(公告)号:US20210390243A1
公开(公告)日:2021-12-16
申请号:US17245022
申请日:2021-04-30
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Timothy W. FISCHER , Ashish KHANDELWAL , Sreenivasan K. KODURI , Nikhil GUPTA
IPC: G06F30/398 , G06F30/392
Abstract: A technique for designing circuits including receiving a data object representing a circuit for a first process technology, the circuit including a first sub-circuit, the first sub-circuit including a first electrical component and a second electrical component arranged in a first topology; identifying the first sub-circuit in the data object by comparing the first topology to a stored topology, the stored topology associated with the first process technology; identifying a first set of physical parameter values associated with first electrical component and the second electrical component of the first sub-circuit; determining a set of performance parameter values for the first sub-circuit based on a first machine learning model of the first sub-circuit and the identified set of physical parameters; converting the identified first sub-circuit to a second sub-circuit for the second process technology based on the determined set of performance parameter values; and outputting the second sub-circuit.
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公开(公告)号:US20210390232A1
公开(公告)日:2021-12-16
申请号:US17245000
申请日:2021-04-30
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Ashish KHANDELWAL , Sreenivasan K. KODURI , Nikhil GUPTA , Timothy W. FISCHER
IPC: G06F30/27 , G06N3/08 , G06F30/392 , G06F30/398
Abstract: A technique for designing circuits including receiving a data object representing a circuit for a first process technology, the circuit including a first sub-circuit, the first sub-circuit including a first electrical component and a second electrical component arranged in a first topology; identifying the first sub-circuit in the data object by comparing the first topology to a stored topology, the stored topology associated with the first process technology; identifying a first set of physical parameter values associated with first electrical component and the second electrical component of the first sub-circuit; determining a set of performance parameter values for the first sub-circuit based on a first machine learning model of the first sub-circuit and the identified set of physical parameters; converting the identified first sub-circuit to a second sub-circuit for the second process technology based on the determined set of performance parameter values; and outputting the second sub-circuit.
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