PROCESS AWARE COMPACT REPRESENTATION OF INTEGRATED CIRCUITS

    公开(公告)号:US20210390237A1

    公开(公告)日:2021-12-16

    申请号:US17245253

    申请日:2021-04-30

    Abstract: A technique for designing circuits including receiving a data object representing a circuit for a first process technology, the circuit including a first sub-circuit, the first sub-circuit including a first electrical component and a second electrical component arranged in a first topology; identifying the first sub-circuit in the data object by comparing the first topology to a stored topology, the stored topology associated with the first process technology; identifying a first set of physical parameter values associated with first electrical component and the second electrical component of the first sub-circuit; determining a set of performance parameter values for the first sub-circuit based on a first machine learning model of the first sub-circuit and the identified set of physical parameters; converting the identified first sub-circuit to a second sub-circuit for the second process technology based on the determined set of performance parameter values; and outputting the second sub-circuit.

    AUTOMATED GEOMETRY OPTIMIZATION FOR ANALOG, MIXED-SIGNAL CIRCUIT DESIGN

    公开(公告)号:US20210390233A1

    公开(公告)日:2021-12-16

    申请号:US17245083

    申请日:2021-04-30

    Abstract: A technique for designing circuits including receiving a data object representing a circuit for a first process technology, the circuit including a first sub-circuit, the first sub-circuit including a first electrical component and a second electrical component arranged in a first topology; identifying the first sub-circuit in the data object by comparing the first topology to a stored topology, the stored topology associated with the first process technology; identifying a first set of physical parameter values associated with first electrical component and the second electrical component of the first sub-circuit; determining a set of performance parameter values for the first sub-circuit based on a first machine learning model of the first sub-circuit and the identified set of physical parameters; converting the identified first sub-circuit to a second sub-circuit for the second process technology based on the determined set of performance parameter values; and outputting the second sub-circuit.

    MULTI-LEAD ADAPTER
    4.
    发明申请
    MULTI-LEAD ADAPTER 审中-公开

    公开(公告)号:US20200343165A1

    公开(公告)日:2020-10-29

    申请号:US16394564

    申请日:2019-04-25

    Abstract: In some examples, a device comprises an electronic component having multiple electrical connectors, the multiple electrical connectors configured to couple to a printed circuit board (PCB) and having a first footprint. The device also comprises a multi-lead adapter comprising multiple rows of leads arranged in parallel, the leads in the rows configured to couple to the electrical connectors of the electronic component and having a second footprint that has a different size than the first footprint.

    PROGRAMMATIC CIRCUIT PARTITIONING AND TOPOLOGY IDENTIFICATION

    公开(公告)号:US20210390239A1

    公开(公告)日:2021-12-16

    申请号:US17245057

    申请日:2021-04-30

    Abstract: A technique for designing circuits including receiving a data object representing a circuit for a first process technology, the circuit including a first sub-circuit, the first sub-circuit including a first electrical component and a second electrical component arranged in a first topology; identifying the first sub-circuit in the data object by comparing the first topology to a stored topology, the stored topology associated with the first process technology; identifying a first set of physical parameter values associated with first electrical component and the second electrical component of the first sub-circuit; determining a set of performance parameter values for the first sub-circuit based on a first machine learning model of the first sub-circuit and the identified set of physical parameters; converting the identified first sub-circuit to a second sub-circuit for the second process technology based on the determined set of performance parameter values; and outputting the second sub-circuit.

    MULTI-ALGORITHMIC APPROACH TO REPRESENT HIGHLY NON-LINEAR HIGH DIMENSIONAL SPACE

    公开(公告)号:US20210390234A1

    公开(公告)日:2021-12-16

    申请号:US17245306

    申请日:2021-04-30

    Abstract: A technique for designing circuits including receiving a data object representing a circuit for a first process technology, the circuit including a first sub-circuit, the first sub-circuit including a first electrical component and a second electrical component arranged in a first topology; identifying the first sub-circuit in the data object by comparing the first topology to a stored topology, the stored topology associated with the first process technology; identifying a first set of physical parameter values associated with first electrical component and the second electrical component of the first sub-circuit; determining a set of performance parameter values for the first sub-circuit based on a first machine learning model of the first sub-circuit and the identified set of physical parameters; converting the identified first sub-circuit to a second sub-circuit for the second process technology based on the determined set of performance parameter values; and outputting the second sub-circuit.

    AUTOMATED ANALOG AND MIXED-SIGNAL CIRCUIT DESIGN AND VALIDATION

    公开(公告)号:US20210390243A1

    公开(公告)日:2021-12-16

    申请号:US17245022

    申请日:2021-04-30

    Abstract: A technique for designing circuits including receiving a data object representing a circuit for a first process technology, the circuit including a first sub-circuit, the first sub-circuit including a first electrical component and a second electrical component arranged in a first topology; identifying the first sub-circuit in the data object by comparing the first topology to a stored topology, the stored topology associated with the first process technology; identifying a first set of physical parameter values associated with first electrical component and the second electrical component of the first sub-circuit; determining a set of performance parameter values for the first sub-circuit based on a first machine learning model of the first sub-circuit and the identified set of physical parameters; converting the identified first sub-circuit to a second sub-circuit for the second process technology based on the determined set of performance parameter values; and outputting the second sub-circuit.

    AUTOMATED ANALOG AND MIXED-SIGNAL CIRCUIT DESIGN AND VALIDATION

    公开(公告)号:US20210390232A1

    公开(公告)日:2021-12-16

    申请号:US17245000

    申请日:2021-04-30

    Abstract: A technique for designing circuits including receiving a data object representing a circuit for a first process technology, the circuit including a first sub-circuit, the first sub-circuit including a first electrical component and a second electrical component arranged in a first topology; identifying the first sub-circuit in the data object by comparing the first topology to a stored topology, the stored topology associated with the first process technology; identifying a first set of physical parameter values associated with first electrical component and the second electrical component of the first sub-circuit; determining a set of performance parameter values for the first sub-circuit based on a first machine learning model of the first sub-circuit and the identified set of physical parameters; converting the identified first sub-circuit to a second sub-circuit for the second process technology based on the determined set of performance parameter values; and outputting the second sub-circuit.

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