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Patent Agency Ranking
公开(公告)号：US10477679B2
公开(公告)日：2019-11-12
申请号：US15864301
申请日：2018-01-08
Applicant: Toppan Forms Co., Ltd.
Inventor： Kumi Hirose , Takuya Sekiguchi , Nariaki Nawa
Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.
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公开(公告)号：US09371465B2
公开(公告)日：2016-06-21
申请号：US14371913
申请日：2013-01-25
Applicant: Toppan Forms Co., LTD.
Inventor： Kumi Hirose , Marina Imai
IPC: C09D11/52 , C09D11/037 , C09D11/322 , C08K5/01 , C08K5/05 , C08K5/098 , C08K5/17 , H01B1/22 , C09D11/30
Abstract: A silver ink composition Which includes a silver carboxylate having a group represented by a formula iCOOAg, an aliphatic primary amine or secondary amine having 2 to 10 carbon atoms, an acetylene alcohol represented by a general formula (2) shown below, and a hydrocarbon having 6 to 20 carbon atoms, and has a viscosity at 27° C. of 40 mPa-s or less, in the formula, each of R′ and R″ independently represents an alkyl group having 1 to 20 carbon atoms or a phenyl group in which one or more hydrogen atoms may be substituted with a substituent.
Abstract translation: 一种银墨水组合物，其包含具有由式iCOOAg表示的基团的羧酸银，具有2至10个碳原子的脂族伯胺或仲胺，由以下通式（2）表示的乙炔醇和具有 6〜20个碳原子，在27℃下的粘度为40mPa·s以下，式中，R'和R“各自独立地表示碳原子数1〜20的烷基或苯基， 其中一个或多个氢原子可被取代基取代。
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公开(公告)号：US20160330835A1
公开(公告)日：2016-11-10
申请号：US15110977
申请日：2015-01-23
Applicant: TOPPAN FORMS CO., LTD.
Inventor： Kumi Hirose , Takuya Sekiguchi , Nariaki Nawa
CPC classification number: H05K1/092 , G06F3/041 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K1/0225 , H05K1/0274 , H05K3/1275 , H05K2201/032 , H05K2201/09681 , H05K2201/098
Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.
Abstract translation: 布线板包括：通过印刷方法形成在基板上的细银线，其中细银线被构造成使得其在与其线长度方向垂直的方向上的横截面中的宽度为20μm或更小 ，其顶部的宽度小于与基板接触的接触部分的宽度，并且细银线的体积电阻率为15μΩ·cm以下。
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公开(公告)号：US20150008376A1
公开(公告)日：2015-01-08
申请号：US14371913
申请日：2013-01-25
Applicant: Toppan Forms Co., LTD.
Inventor： Kumi Hirose , Marina Imai
Abstract: A silver ink composition which includes a silver carboxylate having a group represented by a formula —COOAg, an aliphatic primary amine or secondary amine having 2 to 10 carbon atoms, an acetylene alcohol represented by a general formula (2) shown below, and a hydrocarbon having 6 to 20 carbon atoms, and has a viscosity at 27° C. of 40 mPa·s or less, (In the formula, each of R′ and R″ independently represents an alkyl group having 1 to 20 carbon atoms or a phenyl group in which one or more hydrogen atoms may be substituted with a substituent.)
Abstract translation: 一种银墨水组合物，其包含具有由式-COOAg表示的基团的羧酸银，具有2至10个碳原子的脂族伯胺或仲胺，由以下通式（2）表示的乙炔醇和烃 具有6〜20个碳原子，在27℃下的粘度为40mPa·s以下（式中，R'和R“各自独立地表示碳原子数1〜20的烷基或苯基 基团，其中一个或多个氢原子可以被取代基取代。）
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公开(公告)号：US20180153034A1
公开(公告)日：2018-05-31
申请号：US15864301
申请日：2018-01-08
Applicant: Toppan Forms Co., Ltd.
Inventor： Kumi Hirose , Takuya Sekiguchi , Nariaki Nawa
CPC classification number: H05K1/092 , G06F3/041 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K1/0225 , H05K1/0274 , H05K3/1275 , H05K2201/032 , H05K2201/09681 , H05K2201/098
Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.
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