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公开(公告)号:US20230027417A1
公开(公告)日:2023-01-26
申请号:US17785582
申请日:2021-01-27
Applicant: TORAY INDUSTRIES, INC.
Inventor: Ko MATSUKAWA , Shizue KOYANAGI , Masanori HIRANO , Nobuyuki TOMIOKA
Abstract: The purpose of the present invention is to provide: a molding material from which a carbon fiber reinforced composite material having excellent impact resistance and tensile strength is obtained; and a molding material from which a glass fiber reinforced composite material, that has high bending strength and impact resistance, has excellent weather resistance, and can suppress a decrease in bending strength after water absorption, is obtained. In order to achieve the purpose, the molding material according to the present invention is a molding material formed of an epoxy resin composition and a carbon fiber and/or a glass fiber, wherein the epoxy resin composition includes all of [A] to [C], the carbon fiber satisfies conditions [a] and [b], and the glass fiber has a surface functional group capable of forming a covalent bond with an isocyanate group. [A] Epoxy resin having at least two oxylan groups in molecule [B] Epoxy resin curing agent having at least two isocyanate groups in molecule [C] Catalyst [a] Having substantially perfect circular cross section [b] Average fiber diameter of 4.0-8.0 μm
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公开(公告)号:US20170306117A1
公开(公告)日:2017-10-26
申请号:US15509968
申请日:2015-08-27
Applicant: TORAY INDUSTRIES, INC.
Inventor: Ayako FUSE , Nobuyuki TOMIOKA , Shizue KOYANAGI , Nobuyuki ARAI , Shirou HONDA
CPC classification number: C08J5/24 , C08G59/245 , C08G59/28 , C08G59/3227 , C08G59/38 , C08G59/5033 , C08G59/504 , C08J5/042 , C08J2363/02 , C08J2463/00 , C08J2477/02 , C08J2481/06 , C08L63/00 , C08L2205/02 , C08L2205/035 , C08L77/00 , C08L81/06
Abstract: Provided is an epoxy resin composition with improved heat resistance and resin elongation. Further provided is a fiber-reinforced composite material which uses the epoxy resin composition and thereby excels in compression strength in high-temperature environments and interlaminar toughness. The epoxy resin composition comprises the constituents [A], [B] and [C], 8-40 mass % of [B] is contained in the epoxy resin composition. The number of moles of active hydrogen contained in [C] is 1.05-2.0 times the number of moles of epoxy groups contained in the entire epoxy resin composition, in a cured resin formed by curing the epoxy resin composition and having a degree of curing of at least 90% obtained by DSC (differential scanning catorimetry), [A], [B] and [C] form a monolayer structure, or a phase separation structure of less than 500 nm. The rubber state modulus of elasticity Y (MPa) and glass transition temperature X (° C.) obtained by DMA (dynamic mechanical analysis) of the cured resin satisfy formula (1). [A] amine type epoxy resin [B] thermoplastic resin [C] aromatic amine 0.19X/° C.-31.5≦Y/MPa≦0.19X/° C.-27 (1)
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