公开(公告)号：US20240359145A1

公开(公告)日：2024-10-31

申请号：US18764614

申请日：2024-07-05

Applicant: Solvay SpecialtyPolymers USA, LLC

Inventor： Emanuele DI NICOLO' ,  Pasquale CAMPANELLI ,  David B. THOMAS

IPC: B01D71/68 ,  A61M1/16 ,  B01D61/24 ,  B01D69/02 ,  B01D71/52 ,  C08L81/06

CPC classification number: B01D71/68 ,  A61M1/1621 ,  B01D61/243 ,  B01D69/02 ,  B01D71/522 ,  C08L81/06 ,  B01D2325/36 ,  C08L2201/56

Abstract: A purification method for a biological fluid comprising at least a filtration step through a membrane obtained from a sulfone polymer (PSI) derived from bio-based feed-stocks. In particular the polymer (PSI) comprises more than 50% moles recurring units (RPSI) comprising sugar moieties selected from the group consisting of those of formulae (E′-I) to (E′-III):




A membrane free from pore-forming agents comprising at least one sulfone polymer (PSI) and a method for preparing such a membrane.

公开(公告)号：USRE50084E1

公开(公告)日：2024-08-20

申请号：US17371140

申请日：2021-07-09

Applicant: Fresenius Medical Care Holdings, Inc.

Inventor： Cheryl Ford ,  Jiunn Teo ,  Leslie Schmidt

IPC: C08L81/06 ,  B01D63/02 ,  B01D69/02 ,  B01D69/08 ,  B01D71/44 ,  B01D71/68 ,  B29D99/00 ,  D01D5/24 ,  D01F6/66

CPC classification number: C08L81/06 ,  B01D63/02 ,  B01D69/02 ,  B01D69/087 ,  B01D71/44 ,  B01D71/68 ,  B29D99/0078 ,  D01D5/24 ,  D01F6/66 ,  B01D2323/12 ,  B01D2325/20

Abstract: The present invention relates to the use of additives in processes to form polymeric fibers. These fibers can be formed into membranes with improved middle and/or higher molecular weight solute removal.

公开(公告)号：US11807723B2

公开(公告)日：2023-11-07

申请号：US17277556

申请日：2019-09-20

Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED

Inventor： Kazuyuki Ito

IPC: C08G75/23 ,  C08L81/06

CPC classification number: C08G75/23 ,  C08L81/06 ,  C08L2201/08 ,  C08L2203/30

Abstract: A poly(biphenyl ether sulfone) resin substantially comprising a repeating structure of the following formula (1), wherein a polystyrene equivalent mass average molecular weight Mw and a melt viscosity μ at a temperature of 350° C. satisfy formulas (6) and (7),






wherein n represents an integer of 1 or more,

60,000≤Mw≤90,000  (6)

0.0906×Mw−4,930≤μ≤3,500  (7).

公开(公告)号：US20230347471A1

公开(公告)日：2023-11-02

申请号：US18349491

申请日：2023-07-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： An-Hsuan Lee ,  Ming-Shiuan She ,  Chen-Hao Wu ,  Chun-Hung Liao ,  Shen-Nan Lee ,  Teng-Chun Tsai

IPC: B24B37/24 ,  C09G1/02 ,  B24B37/10 ,  B32B3/12 ,  B32B3/10 ,  C08J9/26

CPC classification number: B24B37/24 ,  C09G1/02 ,  B24B37/107 ,  B32B3/12 ,  B32B3/10 ,  C08J9/26 ,  C08L81/06

Abstract: A method disclosed herein includes forming a polishing pad configured for a chemical-mechanical polishing (CMP) process and polishing a workpiece using the polishing pad and a CMP slurry. Forming the polishing pad includes forming an interpenetrating polymer network having a first phase and a second phase embedded in the first phase, removing the second phase from the interpenetrating polymer network, thereby forming a porous top pad that includes a network of pores embedded in the first phase, and adhering the porous top pad to a sub pad, thereby forming the polishing pad. The second phase is different from the first phase in composition, and the interpenetrating polymer network has a substantially periodic pattern. Surface roughness of the porous top pad is consistent during the polishing of the workpiece.

公开(公告)号：US11787926B2

公开(公告)日：2023-10-17

申请号：US17191785

申请日：2021-03-04

Applicant: Eaton Intelligent Power Limited

Inventor： Javed Abdurrazzaq Mapkar ,  Richard Mauro de Luna

IPC: C08L27/18 ,  C08L81/04 ,  C08L83/04 ,  B29C48/29 ,  C08K3/04 ,  C08L79/08 ,  B29C70/02 ,  B29C70/88 ,  B29C64/124 ,  C08K3/08 ,  C08L81/06 ,  C08L77/00 ,  B29K509/08 ,  B29K71/00 ,  B29K77/00 ,  B29K507/04

CPC classification number: C08L27/18 ,  B29C48/29 ,  B29C64/124 ,  B29C70/023 ,  B29C70/882 ,  C08K3/041 ,  C08K3/042 ,  C08K3/08 ,  C08L77/00 ,  C08L79/08 ,  C08L81/04 ,  C08L81/06 ,  C08L83/04 ,  B29K2071/00 ,  B29K2077/00 ,  B29K2507/04 ,  B29K2509/08 ,  C08K2003/085 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/005

Abstract: A composite material for use as a deposition material in an additive manufacturing system comprises a polymer component, a filler component, and an extrudability component. The extrudability component is present in the composite material is an amount of from 0.05 wt % to 10 wt % based on the weight of the composite material, and can comprise polyhedral oligomeric silsesquioxane (POSS). The polymer component comprises a high temperature polymer such as an engineering polymer or a high performance polymer. The filler component comprises at least one of a conductive component and a strengthening component. In some cases, the conductive component is present in an amount such that the composite material is formed as one of an electrostatic discharge (ESD) material and an EMI/EMC shielding material. The composite material can be deposited in a liquid state on a substrate using an additive manufacturing system, to produce a three-dimensional object.

公开(公告)号：US20230212395A1

公开(公告)日：2023-07-06

申请号：US18177196

申请日：2023-03-02

Applicant: SOLVAY SPECIALTY POLYMERS USA, LLC

Inventor： Stéphane JEOL ,  Maryam MOMTAZ ,  Corinne BUSHELMAN ,  William E. SATTICH

IPC: C08L81/06 ,  C08L81/02 ,  C08K3/32 ,  C08K3/26

CPC classification number: C08L81/06 ,  C08L81/02 ,  C08K3/32 ,  C08K3/26 ,  C08K2003/324 ,  C08K2003/262

Abstract: A polymer composition includes a poly(para-phenylene sulfide) (PPS), at least one poly(aryl ether sulfone) (PAES), and at least one alkali metal carbonate. Preferably, the polymer composition is free or substantially free of solvent. A method includes melt mixing a poly(para-phenylene sulfide) (PPS), at least one poly(aryl ether sulfone) (PAES), and at least one alkali metal carbonate.

公开(公告)号：US11654615B2

公开(公告)日：2023-05-23

申请号：US16771702

申请日：2018-12-19

Applicant: SOLVAY SPECIALTY POLYMERS USA, LLC

Inventor： Stéphane Jeol ,  Nancy J. Singletary ,  Ryan Hammonds ,  Hai Van ,  David B. Thomas

IPC: B29C64/118 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  B33Y70/10 ,  C08L65/02 ,  C08L71/12 ,  C08L79/08 ,  C08L81/06

CPC classification number: B29C64/118 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/10 ,  B33Y80/00 ,  C08L65/02 ,  C08L71/12 ,  C08L79/08 ,  C08L81/06 ,  C08G2261/312

Abstract: A method for manufacturing a three-dimensional (3D) object with an additive manufacturing system, comprising a step consisting in printing layers of the 3D object from the part material comprising a polymeric component comprising, based on the total weight of the polymeric component:



from 5 to 95 wt. % of at least one polymer (P1) comprising at least 50 mol. % of recurring units (R1) consisting of an arylene group comprising at least one benzene ring, each recurring unit (R1) being bound to each other through C—C bonds, wherein the recurring units (R1) are such that, based on the total number of moles of recurring units (R1):less than 90 mol. % are rigid rod-forming arylene units (R1-a), and at least 10 mol. % are kink-forming arylene units (R1-b), and
from 5 to 95 wt. % of at least one polymer (P2), having a glass transition temperature (Tg) between 140° C. and 265° C., and no melting peak, as measured by differential scanning calorimetry (DSC) according to ASTM D3418.

公开(公告)号：US20190218393A1

公开(公告)日：2019-07-18

申请号：US16307017

申请日：2017-06-19

Applicant: SABIC Global Technologies B.V

Inventor： Dadasaheb V. PATIL ,  Peter JOHNSON ,  Wei ZHAO

IPC: C08L79/08 ,  C08L71/12 ,  C08L81/04 ,  C08G73/10

CPC classification number: C08L79/08 ,  C08G73/1053 ,  C08G73/106 ,  C08G73/1064 ,  C08G73/1071 ,  C08L71/12 ,  C08L81/04 ,  C08L81/06 ,  C08L2203/12 ,  C08L2203/16 ,  C08L2203/206 ,  C08L2203/30 ,  C08L81/10 ,  C08L83/04 ,  C08L71/00

Abstract: A polymer composition includes a poly(biphenyl etherimide) of the formula wherein Z and R are as defined herein, and having a glass transition temperature of greater than 230° C. and a second polymer that is not the same as the poly(biphenyl etherimide). A method of making the polymer composition includes melt-mixing the poly(biphenyl etherimide) and the second polymer. Articles comprising the polymer composition and methods of forming the articles are also described.

公开(公告)号：US20190035556A1

公开(公告)日：2019-01-31

申请号：US16082977

申请日：2017-02-17

Applicant: The Penn State Research Foundation

Inventor： Qiming ZHANG ,  Yash THAKUR ,  James RUNT ,  Tian ZHANG

IPC: H01G4/18 ,  C08L75/02 ,  C08L79/08 ,  C08L81/06 ,  C08K3/22 ,  C08K3/38 ,  H01G4/33

CPC classification number: H01G4/18 ,  C08K3/22 ,  C08K3/38 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2201/005 ,  C08L75/02 ,  C08L79/08 ,  C08L81/06 ,  C08L2203/16 ,  H01G4/20 ,  H01G4/33

Abstract: Dielectric capacitors including dielectric compositions with high dielectric constant, low dielectric loss, and high thermal stability are disclosed. The dielectric compositions can include a dipolar polymer having a high glass transition temperature (e.g., Tg>150° C.) in combination with either (i) another dipolar polymer having a high glass transition temperature (e.g., Tg≥150° C.) in the form of a blend, or (ii) the dipolar polymer with an inorganic interfacial agent volume content less than 2 vol % in the dielectric composition.

公开(公告)号：US20180354900A1

公开(公告)日：2018-12-13

申请号：US15781310

申请日：2016-12-06

Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.

Inventor： Katsumi TAKANO ,  Takeshi TAKEUCHI ,  Hiroyuki SHIRAISHI

IPC: C07C321/28

CPC classification number: C07C321/28 ,  C08G75/14 ,  C08G75/20 ,  C08G2650/40 ,  C08K5/372 ,  C08L81/06 ,  C08L101/00

Abstract: Provided is a composition that is improved in terms of caking of a disulfide compound. Specifically, the present invention provides a composition containing 0.01 parts by mass or more of an anticaking agent per 100 parts by mass of a disulfide compound represented by formula (1) (wherein R1 and R2 each independently represent a hydrogen atom, a C1-20 alkyl group, a hydroxy group, a C1-20 alkoxy group, a substituted or unsubstituted amino group, a nitro group, or a halogen atom).